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Solid electrolytic condenser packaging structure used for reducing equivalent series resistance and production method thereof

A technology of equivalent series resistance and solid-state electrolysis, applied in solid electrolytic capacitors, electrolytic capacitors, capacitors, etc. The effect of crystal strength

Active Publication Date: 2013-12-18
钰邦电子(无锡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional design of solid electrolytic capacitors still cannot effectively reduce the equivalent series resistance (equivalent series resistance, ESR)

Method used

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  • Solid electrolytic condenser packaging structure used for reducing equivalent series resistance and production method thereof
  • Solid electrolytic condenser packaging structure used for reducing equivalent series resistance and production method thereof
  • Solid electrolytic condenser packaging structure used for reducing equivalent series resistance and production method thereof

Examples

Experimental program
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Effect test

no. 1 example 〕

[0063] see Figure 1 to Figure 6 as shown, figure 1 It is a schematic side view sectional view of the first stacked capacitor 10 or the second stacked capacitor 10', Figure 2A is a schematic diagram of the upper side of one of the conductive units 3, Figure 2B is a schematic diagram of the upper side of another conductive unit 3, Figure 2C It is a schematic diagram of the upper side of yet another conductive unit 3, image 3 is a schematic top view of the first stacked capacitor 10 disposed on the conductive unit 3, Figure 4 is a schematic side view of the solid electrolytic capacitor packaging structure Z, Figure 5 for Figure 4 The enlarged schematic diagram of part A in, Image 6 It is a flow chart of the manufacturing method of the package structure Z of the solid electrolytic capacitor. As can be seen from the above drawings, the first embodiment of the present invention provides a solid electrolytic capacitor packaging structure Z for reducing the equivalent ...

no. 2 example

[0074] see Figure 7 and Figure 8 as shown, Figure 7 is a schematic side view of the package structure of a solid electrolytic capacitor, and Figure 8 for Figure 7 An enlarged schematic view of part A in Fig. Depend on Figure 7 and Figure 4 comparison of, and Figure 8 and Figure 5 It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment lies in: figure 1 , Figure 7 and Figure 8As shown, in the second embodiment, the capacitor unit 1 includes a plurality of second stacked capacitors 10' that are stacked together in sequence and electrically connected to each other. Wherein, each second stacked capacitor 10' has a second positive part P' and a second negative part N', and the second stacked capacitor 10' at the bottom can be fixed on the second conductive terminal by conductive glue 11. 32 on the lower surface 3201, and the conductive adhesive 11 has a third conductive part...

no. 3 example

[0077] see Figure 9 and Figure 10 as shown, Figure 9 is a schematic top view of the first stacked capacitor disposed on the conductive unit, and Figure 10 It is a schematic side view of the package structure of a solid electrolytic capacitor. Depend on Figure 9 and image 3 comparison of, and Figure 10 and Figure 4 It can be seen from the comparison that the biggest difference between the three embodiments of the present invention and the first embodiment is that: in the third embodiment, the second conductive terminal 32 has an upper surface 3200, a lower surface 3201 corresponding to the upper surface 3200, a The side surface 3204 connected between the upper surface 3200 and the lower surface 3201 , and at least one through slot 3205 connected between the upper surface 3200 , the lower surface 3201 and the side surface 3204 . The bottommost first stacked capacitor 10 can be fixed on the upper surface 3200 of the second conductive terminal 32 through the conduct...

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PUM

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Abstract

The invention discloses a solid electrolytic condenser packaging structure used for reducing equivalent series resistance comprising a capacitor unit, a packaging unit, and a conductive unit. The capacitor unit comprises a plurality of first stack-type capacitors, which are sequentially stacked together, and are electrically connected together. The conductive unit comprises a first conductive terminal and a second conductive terminal provided with at least one through hole. The plurality of first tack-type capacitors are electrically connected between the first conductive terminal and the second conductive terminal. The first stack-type capacitor disposed on the bottom end is fixedly disposed on the upper surface of the second conductive terminal by using the conductive glue, which is provided with a first conductive part disposed between the first stack-type capacitor disposed on the bottom end and the upper surface of the second conductive terminal and a second conductive part connected with the first conductive part and disposed in the through hole in a filled manner.

Description

technical field [0001] The invention relates to a packaging structure of a solid electrolytic capacitor and a manufacturing method thereof, in particular to a packaging structure of a solid electrolytic capacitor for reducing equivalent series resistance and a manufacturing method thereof. Background technique [0002] Capacitors have been widely used in basic components of consumer appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. Their main functions include: filtering, bypassing, rectifying, coupling, decoupling, Turn equal. It is one of the indispensable components in electronic products. Capacitors have different types according to different materials and uses. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors, etc. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, and superior f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/14H01G9/26H01G9/012H01G9/15
Inventor 邱继皓林清封张坤煌黄俊嘉
Owner 钰邦电子(无锡)有限公司
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