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Semiconductor memory device

A memory and semiconductor technology, applied in the fields of semiconductor devices, static memory, digital memory information, etc., can solve the problems of reduced memory cell occupancy, inability to give full play to the advantages of three-dimensional structure, and increased current consumption.

Inactive Publication Date: 2013-12-18
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it is not easy to set the bias voltage, and when it is necessary to perform access under the optimal bias voltage condition, there will be problems such as increased current consumption
[0006] Therefore, when these variable resistance memories are used in mass storage semiconductor memory devices, the size of the access target cell array cannot be sufficiently increased
Therefore, the occupancy rate of the memory cell in the semiconductor memory device is reduced, and the advantages of the three-dimensional structure cannot be fully utilized.

Method used

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  • Semiconductor memory device
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Examples

Experimental program
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Effect test

no. 1 example

[0032]

[0033] figure 1 is a diagram showing the structure of the semiconductor memory device according to the first embodiment. The semiconductor memory device includes a memory cell array 1 . The memory cell array 1 includes a plurality of stacked memory cell mats (memory cell layers). Each memory cell mat (mat) includes a plurality of bit lines BL (first line) and a plurality of word lines WL (second line), and a memory cell MC selected by these word lines WL and bit lines BL.

[0034] The bit line BL in the memory cell pad is electrically connected to the column control circuit 2, which can control the bit line BL by operation and perform erasure of data in the memory cell MC, writing of data in the memory cell MC and from the memory cell MC. Reading data from a memory cell MC (hereinafter, erasing data in a memory cell MC and writing data to a memory cell MC are collectively referred to as a "write operation", and reading data from a memory cell MC is referred to as ...

no. 2 example

[0088] The first embodiment describes access to one memory cell MC, while the second embodiment describes access to a plurality of memory cells MC at the same time.

[0089] A simultaneous read operation on multiple memory cells is described first.

[0090] Figure 3A and 3BThe shown asymmetric variable resistance memory cell (memory cell MC) changes its characteristics when a large amount of current continues to flow into it. Therefore, for the bit line BL used to monitor the cell current, one memory cell needs to be selected on each line to monitor and control the cell current at each memory cell MC.

[0091] Therefore, in this embodiment, when accessing a plurality of memory cells MC at the same time, only one word line WL is selected and a plurality of bit lines BL are selected by performing. The distance between the selected word line WL and the word line driver 3' is shortened to select as many bit lines BL as possible within the allowable current of the selected word...

no. 3 example

[0108] The third embodiment describes a method of sequentially reading data from different memory cells. Hereinafter, the read operation by this method is referred to as "sequential read operation".

[0109] Continuous read operation method can be considered from two aspects. The first is a method of fixing a selected word line and sequentially switching and selecting among bit lines in each access cycle. The second is a method of fixing the selected bit line and sequentially switching and selecting among the word lines in each access cycle. Among these methods, the second one is more advantageous in the instance of floating access method.

[0110] Figure 15 is a diagram showing consecutive read operations in the semiconductor memory device according to the present embodiment. Figure 16 is a graph showing a change in voltage on a bit line when the floating access method of this embodiment is used for one access to a memory cell.

[0111] In the read operation, as descri...

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Abstract

A semiconductor memory device according to the embodiment comprises a memory cell array including a memory cell layer containing plural memory cells operative to store data in accordance with different resistance states; and an access circuit operative to make access to the memory cells, the memory cell changing the resistance state from a first resistance state to a second resistance state on application of a voltage of a first polarity, and changing the resistance state from the second resistance state to the first resistance state on application of a voltage of a second polarity, the access circuit applying voltages, required for access to the memory cell, to first and second lines connected to a selected memory cell, and bringing at least one of the first and second lines connected to non-selected memory cells into the floating state to make access to the selected memory cell.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from prior Japanese Patent Application No. 2011-65619 filed on March 24, 2011, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to semiconductor memory devices. Background technique [0004] As semiconductor memory devices capable of storing a large amount of usage data, memories such as variable resistance memories (ReRAM: Resistive Random Access Memory) that can be easily formed in a three-dimensional space have attracted attention. The cells of these variable resistance memories are characterized by an asymmetric voltage-current characteristic that varies significantly depending on the polarity of the voltage applied to the memory cell. [0005] In general, a semiconductor memory device including a variable resistance memory cell operates on selected memory cells by externally applying a bias vo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C13/00H01L27/10H01L27/105H01L45/00
CPCG11C13/0011G11C13/0023G11C13/004G11C2013/0073G11C2213/71G11C2213/72G11C13/003H10B69/00
Inventor 户田春希
Owner KK TOSHIBA
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