Mounting structure and mounting method

Abstract

A mounting structure includes a first ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a first strain amount, and a second ceramic electronic component including a ceramic body including internal electrodes and outer electrodes. When a voltage is applied to the outer electrodes, the ceramic body is strained with a second strain amount greater than the first strain amount. The second ceramic electronic component is arranged above the first ceramic electronic component, and the first and second ceramic electronic components are connected to each other via each other's outer electrodes. The first ceramic electronic component to which the second ceramic electronic component is connected is connected to a land on a circuit substrate via the outer electrodes of at least the first ceramic electronic component.

Description

technical field

[0001] The invention relates to a mounting structure and a mounting method, in particular to a structure and a method for mounting ceramic electronic components on a circuit substrate. Background technique

[0002] Conventionally, in a multilayer capacitor in which a dielectric layer and a capacitor electrode are stacked, when a voltage containing a ripple component is applied, an electric field-induced strain occurs in the capacitor portion, and the stack expands and contracts. With the advancement of miniaturization and thinning of multilayer capacitors, the voltage applied to each dielectric body has increased, and electric field-induced deformation has become impossible to ignore. When the multilayer capacitor mounted (soldered) on the circuit board generates stretching vibration, it is transmitted to the circuit board to vibrate the circuit board. When the frequency falls in the audible range, that is, 20 Hz to 20 kHz, it is recognized as "sounding" by t...

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