Die bonding procedure of in-line LED bead packaging technology

Abstract

The invention discloses a die bonding procedure of an in-line LED bead packaging technology. The die bonding procedure includes the steps of material feeding, material conveying and discharging. Specifically, the material feeding step includes the process of fixing positive and negative pole pins to supports of a die bonder, conveying the supports to a processing station of the die bonder through a material feeding device, carrying out die bonding operation, fixedly arranging insulation paste and chips on the positive and negative pole pins of the supports on the die bonder, and completing the die bonding operation. The material conveying step includes the process of conveying the supports after the die bonding processing out from the processing station of the die bonder through a material conveying device, locking the supports through a locking device, and pushing a material conveying block to axially move through a pushing device to push the supports out of the processing station of the die bonder. The discharging step includes the process that the supports are discharged one by one through a discharge device, and namely the supports are conveyed out from a discharge rail section to a suspension rod for uniform collection through the pushing device and are discharged one by one through vertical movement of a moving block. The die bonding procedure has the advantages that automation of the whole die bonding operation can be achieved by being combined with the existing die bonder, processing efficiency is high, errors caused by manual operation are reduced, and die bonding processing quality is improved.

Description

technical field [0001] The invention relates to an in-line LED lamp bead packaging process, in particular to the crystal-bonding process of the in-line LED lamp bead packaging process. Background technique [0002] LED lamp bead is a semiconductor electronic component that can emit light. It is referred to as LED in English, also known as light-emitting diode. It is widely used in the lighting industry because of its small size, low power, long service life and environmental protection. [0003] In-line LED lamp beads are a common form of LED lamp beads. Its structure includes positive pins and negative pins. The negative pins are provided with LED chips. The electrical connection is formed by wires, and finally the positive pin, the negative pin and the LED chip are sealed with epoxy resin. [0004] The processing of LED lamp beads generally includes steps such as crystal expansion, crystal bonding, crystal baking, wire bonding, phosphor spraying, sealing, slitting and sor...

AI Technical Summary

Problems solved by technology

At present, the crystal bonding process is generally carried out on the crystal bonding machine. The existing steps of the bonding operation include feeding, processing of the bonding machine, material transfer and unloading. The bracket is placed in the processing station (feeding) of the die-bonding machine, and then the insulating glue and chips are placed on the positive and negative pole feet on the bracket, and finally the bracket is taken out (material transfer and unloading). Operation is error prone and work efficiency is low

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