Die bonding procedure of in-line LED bead packaging technology

A technology of LED lamp beads and packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as error-prone work efficiency, and achieve the effect of improving the quality of die-bonding processing, high processing efficiency, and reducing errors

Inactive Publication Date: 2014-01-01
中山驭明光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the crystal bonding process is generally carried out on the crystal bonding machine. The existing steps of the bonding operation include feeding, processing of the bonding machine, material transfer and unloading. The bracket is placed in the processing stat

Method used

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  • Die bonding procedure of in-line LED bead packaging technology
  • Die bonding procedure of in-line LED bead packaging technology
  • Die bonding procedure of in-line LED bead packaging technology

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Embodiment Construction

[0022] The present invention is specifically described below by the embodiment, only for further illustrating the present invention, can not be interpreted as the limitation of protection scope of the present invention, the technical engineer of this field can make some non-essential improvements and improvements to the present invention according to the content of the above-mentioned invention Adjustment.

[0023] Such as Figure 1-7 As shown in the specific embodiment of the present invention, the crystal bonder used in the crystal bond operation of the present invention directly adopts the conventional crystal bonder on the market, such as the crystal bonder produced by Shenzhen Xinyichang Equipment Company.

[0024] Operation of the present invention comprises the following steps:

[0025] (1) Feeding, fix the positive and negative pins on the bracket of the crystal bonder, then transport the bracket to the processing position of the middle crystal bonder through the feed...

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Abstract

The invention discloses a die bonding procedure of an in-line LED bead packaging technology. The die bonding procedure includes the steps of material feeding, material conveying and discharging. Specifically, the material feeding step includes the process of fixing positive and negative pole pins to supports of a die bonder, conveying the supports to a processing station of the die bonder through a material feeding device, carrying out die bonding operation, fixedly arranging insulation paste and chips on the positive and negative pole pins of the supports on the die bonder, and completing the die bonding operation. The material conveying step includes the process of conveying the supports after the die bonding processing out from the processing station of the die bonder through a material conveying device, locking the supports through a locking device, and pushing a material conveying block to axially move through a pushing device to push the supports out of the processing station of the die bonder. The discharging step includes the process that the supports are discharged one by one through a discharge device, and namely the supports are conveyed out from a discharge rail section to a suspension rod for uniform collection through the pushing device and are discharged one by one through vertical movement of a moving block. The die bonding procedure has the advantages that automation of the whole die bonding operation can be achieved by being combined with the existing die bonder, processing efficiency is high, errors caused by manual operation are reduced, and die bonding processing quality is improved.

Description

technical field [0001] The invention relates to an in-line LED lamp bead packaging process, in particular to the crystal-bonding process of the in-line LED lamp bead packaging process. Background technique [0002] LED lamp bead is a semiconductor electronic component that can emit light. It is referred to as LED in English, also known as light-emitting diode. It is widely used in the lighting industry because of its small size, low power, long service life and environmental protection. [0003] In-line LED lamp beads are a common form of LED lamp beads. Its structure includes positive pins and negative pins. The negative pins are provided with LED chips. The electrical connection is formed by wires, and finally the positive pin, the negative pin and the LED chip are sealed with epoxy resin. [0004] The processing of LED lamp beads generally includes steps such as crystal expansion, crystal bonding, crystal baking, wire bonding, phosphor spraying, sealing, slitting and sor...

Claims

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Application Information

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IPC IPC(8): H01L33/48
CPCH01L33/48H01L2933/005
Inventor 林国仕
Owner 中山驭明光电科技有限公司
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