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Packing structure and method

A packaging structure and packaging method technology, applied in electrical components, electric solid devices, circuits, etc., can solve problems such as poor light transmission performance and energy loss, and achieve the effects of material saving, energy utilization improvement, and easy industrialization.

Inactive Publication Date: 2014-01-15
CHONGQING SILIAN OPTOELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a packaging structure and method for solving the problems of poor light transmission performance and serious energy loss in the prior art.

Method used

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Examples

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no. 1 example

[0035] Such as figure 1 As shown, the present invention provides a first embodiment of a packaging structure, including a shallow cup holder 1 , a chip 2 and a packaging compound 3 .

[0036] Wherein, the shallow cup holder 1 includes a bowl 11 , an electrode substrate 12 at the bottom of the bowl 11 , the bowl 11 has a hollow portion, and the electrode substrate 12 includes a positive electrode 121 and a negative electrode 122 . In this embodiment, the electrode substrate 12 is fixedly disposed on the bottom of the bowl cup 11 . The bowl cup 11 has a depth h≤0.25 mm, that is, the depth of the hollow portion of the bowl cup 11 is less than or equal to 0.25 mm. The purpose of setting the depth of the bowl cup 11 in this way is to make the chip 2 have a shorter optical channel, so as to realize the utilization rate of electric energy or light energy and save energy. Moreover, it can be easily realized that the depth h of the bowl cup 11 is less than or equal to 0.25 mm by manu...

Embodiment 2

[0040] In order to further disclose the creative achievements of the present invention, please refer to figure 2, the present invention provides a second embodiment of a packaging structure, including a shallow cup holder 1 , a chip 2 and a packaging compound 3 . The difference from the above-mentioned first embodiment of the packaging structure is that the chip 2 is installed on the electrode substrate 12 no longer in the traditional front-mounting way, but in a flip-chip way. Therefore, the differences from the above first embodiment of the packaging structure will be mainly described below, and the similarities will not be repeated here. In this embodiment, the chip 2 is electrically connected to the positive electrode 121 and the negative electrode 122 on the electrode substrate 12 by flip-chip method. Using such a method, the upper limit value of the depth h of the bowl cup 11 generally required will be smaller than 0.25 mm.

Embodiment 3

[0042] In order to realize the packaging structure of the present invention, a packaging method is provided, such as image 3 As shown, the present invention provides a first embodiment of a packaging method, including the steps of: 1) providing a bowl with an electrode substrate, the electrode substrate including a positive electrode and a negative electrode; 2) mounting at least one chip on the electrode On the substrate, the chip is electrically connected to the positive electrode and the negative electrode on the electrode substrate; 3) Fill the entire hollow part of the bowl with encapsulant to cover the chip. In this embodiment, the depth h of the bowl cup is ≤0.25 mm, and the encapsulating glue contains phosphor powder, and the mixing ratio of the encapsulating glue and phosphor powder is set according to the needs of the light color and the like in actual situations. Certainly, the encapsulating glue may not contain phosphor according to actual needs. It should be poi...

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Abstract

The invention relates to the packing field of light-emitting elements and provides a packing structure and method. The packing structure comprises a shallow cup support, a chip and packing gel. The shallow cup support comprises a bowl cup and an electrode substrate at the bottom of the bowl cup, the bowl cup is provided with a hollow portion, and the electrode substrate comprises a positive electrode and a negative electrode. The chip is located in the hollow portion of the bowl cup and is fixedly arranged on the electrode substrate, and the chip is correspondingly in electric connection with the positive electrode and the negative electrode on the electrode substrate. The packing gel is arranged in the whole hollow portion of the bowl cup and wraps the chip. The packing structure and method shorten a channel of a ray, so that over-waste of the ray is avoided, resources of electric energy, materials and the like are saved, and cost is saved.

Description

technical field [0001] The invention relates to the packaging field of light-emitting components, in particular to a packaging structure and method. Background technique [0002] The biggest difference between the packaging of LED light-emitting components and the packaging of integrated circuits is that the former requires good light transmission performance after packaging. The packaging of the LED not only needs to be able to protect the chip, but more importantly, it needs to form a good light exit channel, and the light exit channel has good or better light transmission performance. [0003] In the production and manufacture of the existing LED packaging structure, according to the traditional manufacturing process and ideas, the light output channel is longer, and the depth of the bowl is greater than 0.27 mm. This kind of packaging manufacturing process or packaging structure, because the bowl is too deep, it is easy to block light, and part of the light cannot come ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/483H01L33/507H01L33/54H01L33/62H01L2224/4501H01L2933/0033H01L2933/0066
Inventor 刘俊明黄凤斌乜辉龚旭英桂烈兴谭盼
Owner CHONGQING SILIAN OPTOELECTRONICS SCI & TECH
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