Surface mount interconnection system and method for modular circuit board
An interconnection system and surface mount technology, applied in the structural connection of printed circuits, assembly of printed circuits with electrical components, printed circuits, etc., can solve problems such as package failure, disconnection of electronic components and substrates, cracking of solder bumps, etc.
Inactive Publication Date: 2014-01-15
DELPHI TECH INC
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Problems solved by technology
[0005] During operation, solder bump interconnects can crack due to stresses induced by thermal expansion mismatch between the component and substrate, breaking the electrical connection between the electronic component and substrate and causing package failure
Method used
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Embodiment Construction
[0020] see figure 1 , shows an electronic package 10 embodying the present invention. The electronic package 10 includes a main circuit board assembly 12 and a secondary circuit board assembly 14 adapted for selective electrical and mechanical coupling. The main circuit board assembly 12 has a generally planar substrate 16 , such as a rigid printed circuit board (PCB), forming an exposed (upper) surface 18 . A linear array of spaced apart pads 20a-20f is carried on the exposed surface 18 of the substrate 16 along the axis labeled X-X. Each pad 20 is electrically interconnected with various electrical components 22 by one or more conductive traces 24 . Pads 20 a - 20 f , electrical components 22 and conductive traces 24 form a main or first subcircuit assembly 26 . A pair of spaced apart locating features 28 and 30, such as shaped recesses, are formed in the substrate 16 that open into the exposed surface 18 adjacent the array of pads 20a-20f. Each pad 20a-20f is preferably...
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A surface mount interconnection system (10) provides a method and device for a surface mount device withno leads to enable an auxiliary printed circuit board assembly (14) to be directly mounted on a main printed circuit board assembly (12). Solder pads (20, 36), spaced apart, of a linear array are arranged on an exposed surface (18, 34) of a substrate of the two assemblies (12, 14). At least one of said linear arrays of solder pads (20, 36) is disposed substantially adjacent an edge (48) of the substrate (32) associated therewith. A plurality of aligned cooperating pairs of said solder pads (20, 36) are each electrically and mechanically interconnected by a solder ball (50) reflowed to form a joint (66) intermediate an associated pair of solder pads (20, 36). The solder ball (50) includes a relatively high-temperature inner core portion (52) and a relatively low-temperature outer solder layer (54).
Description
technical field [0001] The present invention relates to apparatus for providing electrical connections to circuit boards, and more particularly to providing electrical and mechanical interconnections between circuit boards. Background technique [0002] The interconnection of circuit boards can present problems in terms of cost and reliability, as well as ease of assembly. With parts that typically have leads, header pins can be used to eliminate connectors to reduce part count and improve reliability. [0003] The manufacturing process has progressed to employ more surface mount components that are drive assemblies to eliminate leaded components in the case of surface mount technology. Product design strives to change surface mounts especially for connection systems that are expensive and don't have many options. [0004] It is known to form ball grid array packages including electronic components mounted to a substrate by solder bump interconnects. For example, an assem...
Claims
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IPC IPC(8): H05K1/14H05K1/11H05K3/36
CPCH05K3/3436H05K3/363H05K3/366H05K2203/041Y10T29/49126Y02P70/50
Inventor C·R·施奈德R·L·瓦达斯
Owner DELPHI TECH INC