High Frequency Piezoelectric Ultrasonic Transducers for Integrated Circuit Thermosonic Bonding Equipment
An integrated circuit, piezoelectric ultrasonic technology, applied to circuits, electric solid devices, fluids using vibration, etc., can solve problems affecting bonding quality, ultrasonic field interference of ultrasonic vibration system, etc., to improve utilization rate and reduce axial Vibration coupling, small size effect
Active Publication Date: 2016-01-20
TIANJIN UNIV
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Problems solved by technology
However, increasing the working frequency of the transducer will cause certain problems in its working performance
Ultrasonic transducers are generally installed on thermosonic bonding equipment with a flange structure. When the commonly used flanges are tightened and assembled with screws, the flanges are constrained, and there is an ultrasonic vibration coupling problem between the ultrasonic vibration system and the external connecting parts. , causing the ultrasonic field of the ultrasonic vibration system to be disturbed, thereby affecting the bonding quality
Method used
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[0020] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:
[0021] see figure 1 and figure 2 , a high-frequency piezoelectric ultrasonic transducer for integrated circuit thermosonic bonding equipment, including piezoelectric vibrators and energy concentrators connected to each other, the energy concentrator is provided with a clamping flange 3 and from the beginning to the end The concentrator half-wave conical section 2 and the energy concentrator half-wave cylindrical section 1 are provided in sequence, the piezoelectric vibrator is fixed on the tail end of the energy concentrator half-wave cylindrical section 1, and the clamping flange 3 Fixed at the axial vibration displacement node of the transducer to reduce the axial vibration coupling between the transducer and its external fixed parts.
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The invention discloses a high-frequency piezoelectric ultrasonic transducer used for integrated circuit thermosonic bonding equipment. The high-frequency piezoelectric ultrasonic transducer comprises a piezoelectric vibrator and an energy gathering device which are mutually connected. The energy gathering device is provided with a clamping flange and is sequentially provided with an energy gathering device half-wave circular cone section and an energy gathering device half-wave circular column section. The piezoelectric vibrator is fixed to the tail end of the energy gathering device half-wave circular column section. The clamping flange is fixed to the position of an axial vibration displacement node of the transducer. The high-frequency piezoelectric ultrasonic transducer effectively reduces axial vibration coupling of the transducer and external fixing parts of the transducer, and therefore the utilization ratio of ultrasonic energy is improved, and the service life of the high-frequency piezoelectric ultrasonic transducer is prolonged. Furthermore, due to the adoption of the integrated energy gathering device, large-multiple amplification of vibration is achieved. The transducer can work around frequency points of 125kHz, closely spaced modes do not exist around the resonance point, and low-temperature packaging can be achieved under temperatures below 60DEG C. The high-frequency piezoelectric ultrasonic transducer has the advantages of being high in frequency, small in size, light in weight and the like.
Description
technical field [0001] The invention belongs to the field of integrated circuit processing and manufacturing, in particular to a high-frequency piezoelectric ultrasonic transducer used for integrated circuit thermosonic bonding equipment. Background technique [0002] Thermosonic bonding is one of the important technologies of integrated circuit interconnection packaging, and its packaging form occupies a dominant position in integrated circuit packaging. Thermosonic bonding finally realizes the electrical interconnection between the pins of the integrated circuit and the peripheral circuit by applying heat, pressure and ultrasonic energy at the same time. As the core component of thermosonic bonding equipment, the piezoelectric ultrasonic transducer is used to convert the electrical energy at its two ends into ultrasonic vibration energy. Piezoelectric ultrasonic transducers used for thermosonic bonding of integrated circuits usually work around the frequency point of 60kH...
Claims
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IPC IPC(8): B06B1/06H01L21/607
CPCH01L24/78H01L2224/78H01L2224/85207H01L2924/00H01L2924/00012
Inventor 王福军梁存满田延岭张大卫
Owner TIANJIN UNIV