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Hard and brittle material multi-line cutting method and cutting device

A technology of hard and brittle materials and cutting devices, which is applied in the direction of fine working devices, stone processing equipment, working accessories, etc., can solve problems such as cutting restrictions, and achieve the effect of reducing power and energy consumption

Active Publication Date: 2014-01-29
SUZHOU SILICON PEAK SOLAR TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, sapphires are often cut by swinging, but only sapphires below 2 inches can be cut, and the cutting is greatly restricted.

Method used

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  • Hard and brittle material multi-line cutting method and cutting device
  • Hard and brittle material multi-line cutting method and cutting device
  • Hard and brittle material multi-line cutting method and cutting device

Examples

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Embodiment Construction

[0031] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments of the present invention.

[0032] see image 3 The cutting device shown is mainly used for cutting hard and brittle materials. The cutting device includes a machine base 1, a moving base 2, and a lifting drive mechanism (not shown in the figure). Seat 1. The piece 3 to be cut is arranged on the bottom of the moving seat 2 so as to be rotatable around its own axis through a rotary drive mechanism (not shown in the figure). In this embodiment, the piece 3 to be cut is a sapphire rod.

[0033] see Figure 4 As shown, the piece 3 to be cut is arranged on the moving seat 2 in the following manner: one end surface of the piece 3 to be cut is fixedly bonded with a material plate 8 , and the other end surface of the piece 3 is fixedly bonded with a spherical pad 10 . The bottom of the moving seat 2 is provided with a...

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Abstract

The invention discloses a hard and brittle material multi-line cutting method and cutting device. The cutting device comprises a machine base, and a movable base arranged on the machine base in a lifting manner, wherein a to-be-cut piece is arranged on a lifting base in a manner of rotating around axis thereof; meanwhile, a steel wire for cutting is enabled to be tensioned on a rotary multi-line grooved pulley and multiple cutting wires are enabled to do reciprocating motion. The to-be-cut piece is rotated to be in contact with the steel wire for cutting, and a contact wire between the to-be-cut piece and the steel wire for cutting is relatively short during the cutting process, so that the cutting device is easier to cut super-hard and super-brittle materials with big diameters, the energy consumption of the cutting device is reduced greatly during the cutting process, the power of the cutting device is also reduced to a great extent, continuous and efficient cutting is guaranteed, and the cutting device is applicable to the cutting process of multiple large-size hard and brittle materials.

Description

[0001] technical field [0002] The invention relates to a multi-wire cutting method and cutting device for hard and brittle materials. Background technique [0003] For the cutting of hard and brittle materials such as crystal, silicon wafer, marble, sapphire, etc., the traditional method is to use multiple knives or steel wires for cutting, that is, through the reciprocating motion of the blades or steel wires, the workpiece is cut with oil sand, and the workpiece is cut at the same time. The workpiece can be cut into pieces by descending movement, the cutting principle is as attached figure 1 shown. [0004] Then came the swing cutting. The principle of this cutting is to install the roller 1' and roller 2' which drive the steel wire to reciprocate on the rotary table. During the cutting process, the two rollers drive the steel wire to reciprocate and rotate at the same time. The table swings at a low speed, and the workpiece moves downward to cut the workpiece. The cut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/04
Inventor 李子法方海波
Owner SUZHOU SILICON PEAK SOLAR TECH
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