Device for preparing nickel-plating solution

Abstract

The invention discloses a device for preparing a nickel-plating solution. The device comprises a liquid preparation barrel, a nickel group feeding hole, a water inlet pipeline, a liquid storage barrel and the like. The device is characterized in that a liquid preparation circulating pump is arranged on the liquid preparation barrel; a liquid storage circulating pump and a nickel-plating solution output pipeline are arranged on the liquid storage barrel; extracting pumps are also arranged on the liquid preparation barrel and the liquid storage barrel. The device has the beneficial effects that automation of preparation, storage and transportation of the nickel-plating solution is achieved by using three electric mechanical pumps; the production efficiency is greatly improved. Large-volume liquid preparation and storage barrels are utilized, so that the preparation quantity of the nickel-plating solution is increased; the field efficiency is improved; the device is simple and practical in structure.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor electronic components, in particular to an improvement of a nickel plating solution preparation device. Background technique [0002] The production process of semiconductor wafers requires electroless nickel plating on semiconductor wafers. The electroless nickel plating liquid needs to be prepared at any time according to the output. The solute is nickel group, and the solvent is pure water. It needs to be mixed and stirred evenly according to a certain ratio. For the production line, because of the large amount of nickel plating solution, the volume of the preparation container and the mixing equipment are the factors that affect the mass production of the production. The disadvantages are as follows: the volume of the existing preparation container is small; the preparation frequency of the existing device is high , affecting production efficiency; the existing nickel plati...

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Problems solved by technology

[0002] The production process of semiconductor wafers requires electroless nickel plating on semiconductor wafers. The electroless nickel plating liquid needs to be prepared at any time according to the output. The solute is nickel group, and the solvent is pure water. It needs to be mixed and stirred evenly according to a certain ratio. For the production line, because of the large amount of nickel plating solution, the volume of the preparation container and the mixing equipment are the factors that affect whether the production can be mass-produced. The disadvantages are as follows: the volume of the existing preparation container is small; the preparation frequency of the existing device is high , affecting production efficiency; the existing nickel plating solution preparation device needs to be manually stirred evenly, which has a great impact on the degree of fatigue and uniformity; Untimely supply will restrict output and affect production efficiency

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