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Cross prober card

A probe card and cross-type technology, which is applied in the field of cross-type probe cards, can solve the problems of low efficiency of wafer acceptability testing, and achieve the effects of avoiding WAT test abnormalities, shortening WAT test time, and improving test efficiency

Active Publication Date: 2014-02-05
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at providing a cross in the prior art, when the traditional wafer acceptability test is performed, the chip needs to be rotated multiple times, and the wafer acceptability test is inefficient due to repeated needle sticking. type probe card

Method used

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Embodiment Construction

[0019] In order to illustrate the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0020] see figure 1 , figure 1 Shown is a schematic structural view of the cross-shaped probe card of the present invention. The cross-shaped probe card 1 includes: a probe card board (Prober Card Board, PCB) 11, the probe card board 11 is used to carry the functional test terminals; test terminals 12, the test terminals 12 are arranged in a distributed manner On the peripheral edge of the probe card 11; the probe pins 13, which correspond to the probe pads (not shown) of the device under test, are arranged in a cross shape, and set in the middle of the probe chuck 11 .

[0021] As a specific embodiment, a non-limiting enumeration, in the present invention, the number of test terminals 12 distributed on the circumference of the probe ...

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PUM

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Abstract

A cross prober card comprises a prober card board, test terminals and prober pins. The prober card board is used for bearing the functional test terminals, the test terminals are distributed and arranged on the edge of the circumference of the prober card board, and the prober pins correspond to the prober pads of a device to be tested, are distributed in a cross shape, and are arranged in the middle of the prober card board. The cross prober card can simultaneously complete a transverse module test and a longitudinal module test on a tested unit, chip angle rotation is not needed, WAT test time is greatly shortened, and test efficiency is improved. Meanwhile, according to the cross prober card, it is guaranteed that the prober pins can be arranged in the same plane, and WAT test abnormity due to the fact that the prober pins are arranged in different planes is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor device testing, in particular to a cross-shaped probe card. Background technique [0002] With the development of semiconductor technology, the integrated circuit (Integrated Circuit, IC) is more and more integrated, and the probe pad (Pad) is designed around the chip (Chip), so that there are several cross-shaped probe pads around it. , the chip includes a horizontal testing module and a vertical testing module. In the wafer acceptance test (Wafer Accepted Test, WAT) process, the probe card is the link between the test machine and the device under test, and is used to electrically connect the test machine and the device under test. [0003] Please refer to Fig. 4(a) and Fig. 4(b). Fig. 4(a) to Fig. 4(b) are schematic diagrams showing the structure of the conventional probe card. However, the probes 31 of the conventional probe card 3 are usually designed in a single-row or double-row str...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
Inventor 代瑞娟莫保章席与凌
Owner SHANGHAI HUALI MICROELECTRONICS CORP