Ultra-narrow frame liquid crystal display and chip-on-film (COF) packaging structure of drive circuit thereof

Abstract

The invention discloses an ultra-narrow frame liquid crystal display and a chip-on-film (COF) packaging structure of a drive circuit thereof. The packaging structure comprises a whole flexible circuit board, wherein one side of the whole flexible circuit board is jointed with a frame region of a glass substrate of the liquid crystal display, and the whole flexible circuit board serves as a COF type flexibly-packaged carrier band. Multiple drive chips are respectively jointed with the whole flexible circuit board in the scanning direction in sequence, and signal circuits among adjacent drive chips are arranged on the whole flexible circuit board. In the COF packaging structure, the whole flexible circuit board is utilized to move the signal circuits required by drive integrated circuits (IC) to a COF from the glass substrate, so that pressure drop caused by wiring resistance value increase of the drive IC during large-size ultra-narrow frame design can be avoided, a phenomenon that the large-size ultra-narrow frame enables input voltage transferred to the drive IC to produce pressure drop and accordingly panel color is uneven is avoided, and the product quality is improved.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to a COF packaging structure of an ultra-narrow frame liquid crystal display and a driving circuit thereof. Background technique [0002] Nowadays, in order to meet the needs of various high-density packaging, the semiconductor packaging industry has gradually developed various types of packaging designs. The design concepts of various packaging structures are mostly to make high-density packaging products thinner and more suitable for In increasingly thinner and shorter electronic products, such as narrow bezel LCDs. [0003] In liquid crystal modules using light-emitting diode backlight modules, narrow bezel design is a trend. At present, the thickness of mature product modules can be less than 5 cm (mm), and there is a design requirement for ultra-narrow bezels. , especially in the design of large-size, high-resolution modules. In order to implement narrow bezel design, an...

AI Technical Summary

Problems solved by technology

[0009] Due to the trend of narrowing the frame, that is, minimizing the frame area 12, the width of the wiring 14 will be narrowed along with the narrowing of the edge width of the glass substrate, and its cross-sectional area will be reduced, resulting in a resistance per unit length. If the value increases, if the panel size becomes larger, the trace will become longer and the resistance value will also increase

Images