Printing ink with high adhesive force

A technology with high adhesion and ink, applied in ink, household utensils, applications, etc., can solve the problems of unevenness, small places, short circuits, etc. of the antenna, and achieve good printing effect, good adhesion, and good adaptability Effect

Inactive Publication Date: 2014-02-12
SHANGHAI DEMAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, electronic products are becoming thinner and more functional, and the place where the antenna can be installed is often uneven and small, so it is difficult to use the first three methods, and the existing printing process has problems with the adhesion between the antenna and the metal surface. Firm, falling onto the PCB board will cause defects such as short circuit

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of high-adhesion ink, this ink comprises the component of following weight part content: basic resin acrylic resin (Acryl resin) 30; Auxiliary resin isocyanate resin (Isocyanate resin) (Isocyanate resin) 5; Adhesive agent 0.5; Thickener 0.5; Organic solvent benzene twenty one.

[0023] The above-mentioned inks can be prepared by conventional methods. The following method can be used to prepare the raw materials according to the above ratio, then mix the raw materials, stir at high speed and mix thoroughly, then grind to make the fineness below 15um to obtain the product.

[0024] The resulting ink can be coated on metal surfaces, and circuits (electronic components) can be printed directly on the coating, such as coating the resulting ink on a mobile phone frame, and then printing antennas and the like on the coating.

Embodiment 2

[0026] A high adhesion ink, the ink comprises the following components by weight: basic resin acrylic resin (Acryl resin) 50; auxiliary resin isocyanate resin (Isocyanate resin) 15; adhesive agent 2.0; thickener 2.0; organic solvent two Toluene21.

[0027] The above-mentioned inks can be prepared by conventional methods. The following method can be used to prepare the raw materials according to the above ratio, then mix the raw materials, stir at high speed and mix thoroughly, then grind to make the fineness below 15um to obtain the product.

Embodiment 3

[0029] A high adhesion ink, the ink comprises the following components in parts by weight: basic resin alkyd resin (Alkyd resin) 35; auxiliary resin amino resin (Amino resin) 8; adhesive 1; thickener 1; organic solvent Acetic acid 30.

[0030] The above-mentioned inks can be prepared by conventional methods. The following method can be used to prepare the raw materials according to the above ratio, then mix the raw materials, stir at high speed and mix thoroughly, then grind to make the fineness below 15um to obtain the product.

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PUM

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Abstract

The invention relates to a printing ink with high adhesive force. The printing ink comprises following ingredients, by weight, 30 to 50 parts of a base resin, 5 to 15 parts of an auxiliary resin, 0.5 to 2.0 parts of an adhesive, 0.5 to 2.0 parts of a thickening agent, and 21 to 44 parts of an organic solvent. Compared with existing products, adhesive force of the printing ink is excellent high.

Description

technical field [0001] The invention relates to an ink, in particular to a high-adhesion ink which is coated on a metal surface and can directly print circuits (electronic components) on the coating. Background technique [0002] Nowadays, the development of electronic products is changing with each passing day, and the functions are becoming more and more powerful, while the products are getting smaller and thinner. As one of the important components of electronic products, the performance and size of antennas are directly related to the quality of electronic products. With the miniaturization of wireless communication products, built-in antennas gradually replace external antennas and become the mainstream of antenna design. [0003] For example, the existing mobile phone antennas are usually prepared by the following methods: First, using a flexible printed circuit board (Flexible Printed Circuit Board) process, referred to as FPCB or FPC, is a printed circuit with a patt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/107C09D11/105C09D11/104
Inventor 李起忠
Owner SHANGHAI DEMAN ELECTRONICS TECH
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