Heat sinking acrylic ester adhesive tape
An acrylate and adhesive tape technology, applied in the direction of adhesives, ester copolymer adhesives, adhesive types, etc., can solve the problem of difficult to apply to specific use occasions, the promotion of applications, the heat dissipation effect is not as good as imagined, the electronic The problem of high heat dissipation requirements of components can achieve the effect of facilitating heat dispersion and transmission, avoiding heat concentration and improving service life.
Active Publication Date: 2015-06-10
斯迪克新型材料(江苏)有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.
However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.
In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.
Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits its application promotion; therefore, if a high-performance heat dissipation tape is designed for the characteristics of electronic products, it will become The direction of efforts of those of ordinary skill in the art
Method used
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Embodiment
[0039] Embodiment: A heat-dissipating acrylic adhesive tape, comprising a PET film with a thickness of 0.004 mm to 0.025 mm, an aluminum foil layer coated on the upper surface of the PET film, a thermally conductive adhesive layer coated on the lower surface of the PET film, and a release paper Pasted on the other surface of the thermally conductive adhesive layer, the thermally conductive adhesive layer is obtained by mixing and baking the following components by weight:
[0040] Acrylate Adhesive 100,
[0041] graphite powder 130,
[0042] Solvent 200,
[0043] Curing agent 0.8,
[0044] Coupling agent 0.07;
[0045] Described acrylate adhesive is made up of following components by weight:
[0046] Butyl Acrylate 100,
[0047] Benzoyl peroxide 0.1~1,
[0048] Isooctyl acrylate 50~150,
[0049] Acrylic acid 2~5,
[0050] Methyl methacrylate 10~30,
[0051] Vinyl acetate 0~10,
[0052] 2-hydroxyethyl methacrylate 0.1~1;
[0053] The thickness ratio of the PET film, ...
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Abstract
The invention discloses a heat sinking acrylic ester adhesive tape. A heat-conducting adhesive layer is obtained by mixing the following components in parts by weight and then baking: 100 parts of acrylic ester adhesive, 130 parts of graphite powder, 200 parts of solvent, 0.8 parts of curing agent and 0.07 part of coupling agent, wherein the acrylic ester adhesive comprises the following components in parts by weight: 100 parts of butyl acrylate, 0.1-1 part of benzoyl peroxide, 50-150 parts of 2-ethylhexyl acrylate, 2-5 parts of acrylic acid, 10-30 parts of methyl methacrylate, 0-10 parts of vinyl acetate and 0.1-1 part of 2-hydroxyethyl methacrylate; the solvent is obtained by mixing the following components in percent by weight: 18% of methylbenzene, 68% of ethyl acetate and 40% of butanone. The heat sinking acrylic ester adhesive tape guarantees that thermal conductivities in length direction and thickness direction are improved, and uniform thermal conductivity of the adhesive tape is realized, so that heat diffusion is facilitated, local overheating of the adhesive tape is avoided, performances of the adhesive tape product are improved and service life of the adhesive tape is prolonged.
Description
technical field [0001] The invention relates to a heat-dissipating acrylic adhesive tape, which belongs to the technical field of adhesive materials. Background technique [0002] With the rapid development of the electronics industry, from ordinary desktop computers to notebook computers, tablet computers, and smart phones, technological innovation is advancing by leaps and bounds. Electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissipation effect is not as good as expected....
Claims
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IPC IPC(8): C09J7/02C09J133/08C09J11/04C08F220/18C08F220/06C08F220/14C08F218/08C08F220/28H05K7/20
Inventor 金闯梁豪
Owner 斯迪克新型材料(江苏)有限公司