Welding method for welding power semiconductor modules
A technology of power semiconductors and welding methods, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of long welding time, high manufacturing cost, and large consumption, so as to improve welding efficiency, reduce production costs, and simplify The effect of the soldering step
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[0015] figure 1 The flow chart of the welding method for the welding type power semiconductor module provided by the embodiment of the present invention, the specific steps of the welding method for the welding type power semiconductor module are as follows:
[0016] Step 110, disposing a first solder between the bottom plate of the soldered power semiconductor module and the ceramic layer of the ceramic substrate, and disposing a second solder between the solder layer of the ceramic substrate and the chip.
[0017] Wherein, before heating, the first solder is set between the bottom plate of the welded power semiconductor module and the ceramic layer of the ceramic substrate, and the second solder is set between the solder layer of the ceramic substrate and the chip, in order to realize the first In the welding process, the preparation for the welding between the base plate and the ceramic substrate and between the ceramic substrate and the chip is completed at one time, where...
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