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Light source encapsulating structure for bulb lamp

A packaging structure and bulb lamp technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor heat conduction and heat dissipation performance of light sources, unsatisfactory light output rate, and high processing costs, and achieve low cost, easy wire bonding, increase The effect of adhesion

Inactive Publication Date: 2014-02-12
崔高银
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, most COBs use copper substrates. The heat conduction and heat dissipation performance of the light source is poor, the processing cost is high, and the light output rate is not ideal.

Method used

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  • Light source encapsulating structure for bulb lamp
  • Light source encapsulating structure for bulb lamp

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Experimental program
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Effect test

Embodiment Construction

[0015] Below in conjunction with accompanying drawing, the present invention will be further described;

[0016] Such as figure 1 and figure 2 The bulb light source packaging structure includes a circular packaging substrate 1, and also includes a PPA injection molding plate 3, the front side of the packaging substrate 1 is plated with a layer of silver, and the PPA injection molding plate 3 wraps the packaging substrate 1. On the peripheral surface and the front side, the PPA injection molding plate 3 is provided with a positioning hole, and the positioning hole 7 penetrates the PPA injection molding plate 3 and the packaging substrate 1, and two symmetrical The wire outlet slots 8 are respectively provided with electrode wires 8 in the wire outlet slots 8, and an electrode wire outlet hole 2 is also respectively provided in the wire outlet slots 8.

[0017] As a preference of this embodiment, a step hole 5 is provided in the middle of the PPA injection molding plate 3, an...

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PUM

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Abstract

The invention discloses a light source encapsulating structure for a bulb lamp. The light source encapsulating structure for the bulb lamp comprises a round encapsulating substrate and a PPA injection molding board, wherein the front side of the encapsulating substrate is plated with a layer of silver, the PPA injection molding board wraps the circumferential surface and front side of the encapsulating substrate, positioning holes are formed in the PPA injection molding board and penetrate through the PPA injection molding board and the encapsulating substrate, two symmetrical wire outlet slots are further formed in the PPA injection molding board, electrode wires are arranged in the wire outlet slots respectively, and an electrode wire outlet hole is formed in each of the wire outlet slots. The light source encapsulating structure for the bulb lamp has the advantages that the heat conducting performance is good, the luminous efficiency of a light source is improved, the wires can be welded easily, and the light emitting rate is increased.

Description

technical field [0001] The invention relates to the field of lighting package structures, in particular to a bulb light source package structure. Background technique [0002] COB packaging is chip On board, which is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. If the bare chip is directly exposed to the air, it is easy to be polluted or damaged by humans, which will affect or destroy the function of the chip, so the chip and the bonding wires are encapsulated with glue. PPA is polyphthalamide resin, which is a semi-aromatic polyamide made of terephthalic acid or phthalic acid. [0003] At present, the cost of COB surface light source packaging is relatively high. To reduce the overall cost of the device, in addition to materials, it is also necessary to choose a low-cost and high-efficiency packaging structure. Therefore, how to change the existing pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/58H01L33/62
Inventor 崔高银
Owner 崔高银