Electronic component mounting system, electronic component mounting apparatus and electronic component mounting method

Abstract

The invention provides an electronic component mounting system, an electronic component mounting apparatus and an electronic component mounting method, wherein except the part to be formed as the opening part of an electrode, the other part of a substrate is covered with a protective film. With the above substrate as a target, the printing is ensured to be good in position accuracy. Before the solder printing process, an opening part (8) is optically identified. Meanwhile, the opening position offset between the standard position of the electrode (7) and the actual position of the opening part (8) is stored. Furthermore, with the position of the opening part (8) as a target position, the solder (S) is printed. After that, the printed solder (S) is optically identified. Meanwhile, the solder position offset between the position of the solder (S) and the position of the opening part (8) is stored. During the installation control process, a component mounting mechanism controls a mounting head to transfer electronic components to a single substrate (5). Meanwhile, based on the above opening position offset and the solder position offset, the component mounting mechanism is controlled in such as a way that electronic components (9) are landed in an installation position between the centre-of-gravity position (8*) of the opening part (8) and the centre-of-gravity position (S*) of the printed solder.

Description

technical field [0001] The present invention relates to an electronic component mounting system for manufacturing a mounted substrate by mounting electronic components on a substrate by soldering, an electronic component mounting device and an electronic component mounting method used in the electronic component mounting system. Background technique [0002] Along with the miniaturization of electronic equipment, the mounting density of circuit boards is also increasing, and the positional accuracy when mounting electronic components on the electrodes for electronic component bonding on the substrate is also becoming more refined. In order to cope with such high mounting position accuracy, a feed-forward method is introduced that measures the electrode position error that occurs when electrodes are formed on the board and the printing position of the solder printed on the electrodes for each board. errors, and then transmit the error information to the post-process equipment...

AI Technical Summary

Problems solved by technology

In reality, however, the target position to be printed with solder is the opening of the resist film, so when the position of the opening on the electrode surface deviates from the center of the electrode, the position information of the electrode is directly fed forward as described above. In the way, it is difficult to obtain the desired position correction effect

In addition, if the accuracy of the formation position of the resist film is to be improved, the film formation process is complicated and the production cost is greatly increased.

In this way, in the prior art, when a substrate in which the protective film is formed in a range other than the openings set in the electrodes is targeted, there is a problem that it is difficult to ensure good printing position accuracy.

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