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Method and apparatus for manufacturing lead frames

A lead frame and screen printing technology, applied in the field of integrated circuits, can solve the problems of reducing the production speed and slowness of the lead frame.

Active Publication Date: 2014-03-19
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However the method described in WO 00 / 52231 is slow and reduces lead frame production speed

Method used

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  • Method and apparatus for manufacturing lead frames
  • Method and apparatus for manufacturing lead frames
  • Method and apparatus for manufacturing lead frames

Examples

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Embodiment Construction

[0049] Hereinafter, the present invention will be described by referring to specific embodiments as shown in the drawings. However, the present invention is by no means limited to the specific examples described in the following detailed description. Rather, the specific examples described hereinafter illustrate some aspects of the invention, the scope of which is defined by the claims.

[0050] Further modifications or variations of the present invention will be apparent to those skilled in the art. This description is therefore to be considered to include all such modifications and / or variations of the invention, the scope of which is defined in the claims.

[0051] figure 1 A lead frame 100 obtainable according to one embodiment of the invention is schematically shown. The lead frame 100 includes a plurality of conductive elements 101 and a housing area 102 suitable for housing semiconductor devices such as chips and integrated circuits. The conducting element 101 is us...

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Abstract

The present invention relates to a method and an apparatus for manufacturing lead frames. According to the present invention, a coating layer (120) is formed on one or more predefined portions (A, B, C, D, E, F, G, H) of the surface (110s) of the substrate (100) of the lead frame (100) by delimiting the predefined portions (A, B, C, D, E, F, G, H) by means of screen printing. The employment of screen printing allows the obtainment of large amounts of lead frames with excellent electronic and structural properties in a quick and cost-effective way.

Description

technical field [0001] The invention relates to the field of integrated circuits. In particular, the present invention relates to the fabrication process of lead frames for integrated circuits. More specifically, the present invention relates to a method and a device for producing lead frames by means of screen printing. Background technique [0002] One of the main problems in fabricating leadframes for integrated circuits relates to the need to optimize system performance while reducing or at least limiting production costs. [0003] A lead frame consists of a metal base, also called base metal, usually covered with one or more layers of cover metal. [0004] The substrate is usually made of copper, copper alloys, steel, iron and nickel alloys or nickel and steel alloys (invar). The substrate is produced from a metal sheet that is patterned by means of drilling, cutting or chemical etching to form the parts of the lead frame, such as the conductive segments and the area...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48B41C1/14
CPCH01L21/4821H01L24/43H01L2224/43H01L2924/15747H01L2924/00014H01L2924/12042H01L2924/00H01L2224/45099H01L2224/05599
Inventor P·克雷马
Owner STMICROELECTRONICS SRL
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