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Expanded semiconductor chip and semiconductor device

A semiconductor and chip technology, applied in the field of extended semiconductor chips and semiconductor devices, can solve the problems of increased manufacturing costs and systems, and achieve the effect of preventing physical damage and avoiding the effects of thermal stress

Active Publication Date: 2014-03-19
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently, systems using SiP with relatively low manufacturing costs tend to increase

Method used

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  • Expanded semiconductor chip and semiconductor device
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  • Expanded semiconductor chip and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0035] refer to figure 1 (a)~ figure 1 (c) The first embodiment of the present invention will be described.

[0036] Such as figure 1 (a)~ figure 1 As shown in (c), the semiconductor device 1 according to the first embodiment uses, for example, silicon (Si) as a base material, and consists of a first semiconductor chip 2 having transistors and multilayer wiring layers, and an upper surface (element formation surface) The extended semiconductor chip 3 which holds the first semiconductor chip 2 and includes a plurality of semiconductor chips 31 and 32 is constituted. In the multilayer wiring layers in each of the semiconductor chips 2, 31, and 32, for example, a Low-k material is used as an insulating layer.

[0037] On the surface of the first semiconductor chip 2 facing the extended semiconductor chip 3 and on the surface where the element is formed, a plurality of first external connections made of metals such as copper (Cu), aluminum (Al) or nickel (Ni) are formed. Elec...

no. 2 Embodiment approach

[0067] Below, refer to Figure 7 (a)~ Figure 7 (c) The second embodiment of the present invention will be described.

[0068] Such as Figure 7 (a)~ Figure 7 The semiconductor device 7 according to the second embodiment shown in (c) uses, for example, silicon (Si) as a base material, and consists of an extended semiconductor chip 81 and a second semiconductor chip 82 each having a transistor and a multilayer wiring layer. The semiconductor chip 8 is constituted by a resin substrate (wiring substrate) 9 made of an epoxy resin material or the like as a base material for holding the expanded semiconductor chip on the upper surface. For the multilayer wiring layers in each of the semiconductor chips 81 and 82, for example, a Low-k material is used as an insulating layer.

[0069] The resin expansion part 83 made of epoxy resin material etc. is filled between the mutually adjacent side surfaces of the first semiconductor chip 81 and the second semiconductor chip 82 in the ext...

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PUM

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Abstract

A semiconductor device (1) is provided with: a first semiconductor chip (2) that is provided with first electrodes (21) on the surface; and an expanded semiconductor chip (3) which comprises a second semiconductor chip (31) and a resin expanded part (33) that is formed outwardly from at least one lateral surface of the second semiconductor chip, said expanded semiconductor chip (3) being provided with second electrodes (35) on the surface. The first semiconductor chip and the expanded semiconductor chip are arranged so that the surfaces on which the first electrodes and the second electrodes are formed face each other, and the first electrodes and the second electrodes are connected with each other. Among the second electrodes of the expanded semiconductor chip, those connected with the first electrodes are formed only on the resin expanded part.

Description

technical field [0001] The present invention relates to an extended semiconductor chip and a semiconductor device, and more particularly to a semiconductor device having a flip-chip extended semiconductor chip. Background technique [0002] In systems such as digital televisions and digital video recorders, the amount of data to be handled has increased dramatically due to higher functionality. For this reason, an increase in capacity and a high data transfer rate are required in a semiconductor memory device mounted in a system. [0003] As a semiconductor device equipped with such a semiconductor memory device, there are a system-on-chip (SoC) in which a logic circuit on which a memory controller is mounted and a memory circuit are integrated into one chip, and a logic circuit on which a memory controller is mounted. A chip and a memory circuit chip are stacked and accommodated in a system-in-package (System in Package: SiP) package. [0004] Currently, there is an incre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/065H01L23/538H01L25/16
CPCH01L2924/18162H01L24/96H01L24/06H01L2224/13144H01L2225/06527H01L2224/06155H01L24/05H01L24/19H01L2224/16225H01L2224/05569H01L23/5386H01L24/16H01L23/5389H01L2224/02381H01L2224/06156H01L24/13H01L2224/0239H01L2224/02375H01L2224/131H01L2224/04105H01L2224/0401H01L2924/01029H01L2224/16145H01L24/20H01L2225/06513H01L25/0652H01L2224/12105H01L2924/00014H01L2924/351H01L2924/014H01L2224/05552H01L2924/00
Inventor 岩濑铁平萩原清己
Owner PANASONIC CORP