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Negative temperature coefficient thermistor chip, thermistor and preparation method of chip

A thermistor chip, negative temperature coefficient technology, applied in thermistor and its preparation, the field of negative temperature coefficient thermistor chip, can solve the problem of reduced sensitivity of thermistor

Active Publication Date: 2014-03-26
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the B value of the thermistor is low, when it is applied at a higher temperature, the sensitivity of the thermistor will be reduced, so the lower B value limits the use of the product at higher temperatures

Method used

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  • Negative temperature coefficient thermistor chip, thermistor and preparation method of chip
  • Negative temperature coefficient thermistor chip, thermistor and preparation method of chip
  • Negative temperature coefficient thermistor chip, thermistor and preparation method of chip

Examples

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specific Embodiment approach

[0014] In this specific embodiment, the thermistor chip with a negative temperature coefficient is sintered by transition metal oxide powder, and the transition metal oxide powder includes tricobalt tetroxide Co 3 o 4 , manganese dioxide MnO 2 , Yttrium trioxide Y 2 o 3 , Chromium trioxide Cr 2 o 3 and / or titanium dioxide TiO 2 , the sum of the contents of each component is 100%.

[0015] Among them, transition metal oxides include chromium trioxide Cr 2 o 3 or titanium dioxide TiO 2 When the content ratio is (calculated by molar percentage):

[0016] co 3 o 4 , 30% to 70%;

[0017] MnO 2 , 20% to 60%;

[0018] Y 2 o 3 , greater than 0 and less than or equal to 5%;

[0019] Cr 2 o 3 (or TiO 2 ), 5% to 20%.

[0020] When transition metal oxides include chromium trioxide Cr 2 o 3 and titanium dioxide TiO 2 When the content ratio is (calculated by molar percentage):

[0021] co 3 o 4 , 40% to 60%;

[0022] MnO 2 , 30% to 50%;

[0023] Y 2 o 3 , gre...

Embodiment 1

[0028] Example 1: Co3O4, MnO2, Cr2O3, Y2O3 powders are mixed according to the ratio (mole percentage) 40%: 45%: 11%: 4% to form transition metal oxide powder, and the metal oxide powder is directly sintered to make Negative temperature coefficient thermistor chip. Wherein, the specific sintering temperature is 1200° C. to 1270° C., and the time for maintaining the sintering temperature is between 3 and 9 hours. The thermistor chip assembly that makes in this embodiment makes the thermistor of negative temperature coefficient, the structure of the thermistor that makes is as follows figure 1 shown. The specific preparation process is as follows: Surround the negative temperature coefficient thermistor chip 1 with a layer of slurry containing glass powder, sintering the glass powder slurry to make a glass protective layer 2; The two ends of the thermistor chip 1 with the glass protective layer 2 are coated with a layer of electrode paste, and the electrode paste is sintered to...

Embodiment 2

[0029] Example 2: The components in this example are the same as in Example 1, only the content of the components is different: Co3O4, MnO2, Cr2O3, and Y2O3 powders are used according to the ratio (mole percentage) 34%: 60%: 5%: 1% Mixing is performed to form transition metal oxide powders. According to the formula, the thermistor chip is prepared, and then the thermistor is obtained. The preparation process is the same as in Example 1, and will not be repeated here. It is measured that the resistivity of the thermistor in this embodiment is 3000Ω·mm, and the B value is 4050.

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Abstract

The invention discloses a negative temperature coefficient thermistor chip, a thermistor and a preparation method of the chip. The negative temperature coefficient thermistor chip is formed by sintering transition metal oxide powder, and a formula of the transition metal oxide powder comprises Co3O4, MnO2, Y2O3, Cr2O3 and / or TiO2 according to the specific content. The thermistor is prepared from the negative temperature coefficient thermistor chip. According to the negative temperature coefficient thermistor chip, the thermistor and the preparation method of the chip, the formula of the transition metal oxide powder for preparing the thermistor chip is improved, so that a metal oxide with a novel spinel structure is obtained, the activation energy is lower, and the B value of the obtained thermistor is higher. According to an experimental test result, B values of resistors with low resistance values are all higher by taking the 0402 chip negative temperature coefficient thermistor for example.

Description

【Technical field】 [0001] The invention relates to a thermistor element, in particular to a negative temperature coefficient thermistor chip, a thermistor and a preparation method thereof. 【Background technique】 [0002] Usually, a negative temperature coefficient (Negative Temperature Coefficient, NTC for short) thermistor chip is usually sintered from transition metal oxide powder. The components and content of existing transition metal oxide powders have many systems and many formulas. The material characteristic constant B value of the thermistor is not only affected by the formula of the metal oxide powder, but also related to the resistivity of the thermistor. The larger the resistivity, the higher the B value. Existing powder formulations, such as the common ternary system (Mn-Co-Ni system), quaternary system (Mn-Co-Ni-M, where M = Cu, Fe, Si, Pb, Zn, etc.), its preparation The material characteristic constant B value of the thermistor is low. Taking the 0402 size c...

Claims

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Application Information

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IPC IPC(8): C04B35/01C04B35/622
Inventor 包汉青黄飞王军袁仲宁
Owner SHENZHEN SUNLORD ELECTRONICS
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