A Ceramic Pillar Grid Array Used in Experiments

A technology of ceramic column grid array and ceramic substrate, which is applied in the direction of metal pattern materials, electrical connection printed components, printed circuit components, etc., and can solve the problems of high price and poor availability of CCGA devices

Active Publication Date: 2017-04-05
BEIJING RES INST OF TELEMETRY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art, to provide a ceramic column grid array for testing, the manufacturing cost is only 1,000 yuan, which solves the problems of expensive CCGA devices, poor availability, etc., and it is impossible to conduct a large number of them The problem of process test, the special daisy chain circuit designed on this tool can be used to effectively test the welding quality of CCGA devices, avoiding the influence of process samples that cannot detect welding performance without internal chips

Method used

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  • A Ceramic Pillar Grid Array Used in Experiments
  • A Ceramic Pillar Grid Array Used in Experiments

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0024] A ceramic column grid array for testing, the ceramic column grid array includes a ceramic substrate, welding columns and a printed board;

[0025] The ceramic substrate material is Al 2 o 3 , co-fired at a temperature of 1600 ° C to obtain a ceramic substrate, the bottom of the ceramic substrate is screen-printed with pads with a diameter of 0.8 mm and a daisy chain circuit; the pad spacing is 1.27 mm;

[0026] The diameter of the welding column is 0.5mm, and the material is Pb90Sn10. It is welded with the corresponding pad of the ceramic substrate by reflow soldering, and a total of 717 pieces are required; the welding column is cut into short columns with a length of 2.2mm through the solder wire;

[0027] There are screen-printed pads and daisy chain circuits on the printed board; the pad diameter is 0.8mm, and the pad spacing is 1.27mm;

[0028] There is a daisy chain circuit corresponding to the ceramic substrate on the printed board, and the daisy chain circuit ...

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Abstract

The invention relates to a ceramic column grid array for a test, and belongs to the technical field of electric assembly. The CCGA achieves complete simulation on real CCGA components. Ceramic substrate materials, solder columns, solder pastes and corresponding process and making processes identical to real components are selected by a homemade CCGA test component. A daisy chain circuit is designed on the CCGA to be matched with a daisy chain circuit of a printed board, and the change situations of electrical performance of the CCGA components in the pin welding process can be monitored effectively. The situations that a mass of peripheral circuits need to be designed in the electrical performance test process of the CCGA components in actual use, corresponding components are used, soldering is carried out on all the components, cost is expensive, and the process is complex are avoided.

Description

technical field [0001] The invention relates to a ceramic column grid array used for testing, and belongs to the technical field of electronic assembly. Background technique [0002] The Ceramic Column Grid Array (CCGA) component is an extension of the Ceramic Ball Grid Array (CBGA) package. CCGA does not use high-melt balls, but achieves a significant increase in reliability by using high-melt cylinders and more flexible interconnections. The CCGA package also has the characteristics of high temperature resistance, high pressure resistance and good moisture resistance. At present, CCGA has been widely used in military, aviation and aerospace electronic products, and has become the preferred packaging form for designers. [0003] However, the special packaging form of CCGA devices also increases the difficulty of process implementation and quality assurance; the main manufacturers of this type of devices are giant enterprises in the foreign military field, and domestic res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K1/09
Inventor 廖声冲何伟李国丛王佳
Owner BEIJING RES INST OF TELEMETRY
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