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Method and device for generating semiconductor encapsulation unqualified product map

A production device and production method technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve problems such as time-consuming and labor-intensive inspection of optical machines, and achieve increased productivity and low production costs. , the effect of high production efficiency

Active Publication Date: 2014-04-02
ASE (KUNSHAN) INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This means that under non-strict requirements, the quality inspection of all products by optical machines is time-consuming and labor-intensive

Method used

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  • Method and device for generating semiconductor encapsulation unqualified product map
  • Method and device for generating semiconductor encapsulation unqualified product map

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Embodiment Construction

[0013] In order to better understand the spirit of the present invention, it will be further described below in conjunction with some preferred embodiments of the present invention.

[0014] At the end of the production line of semiconductor packaging, although most of the defective products have been manually marked, the optical machine will still conduct quality inspections on all products when generating the defective product map in order to improve product yield. However, it has been observed that because the vast majority of unqualified products have been manually marked, compared with manual quality inspection, the assistance of optical machines has a very limited improvement in the pass rate, and automatic quality inspection means time-consuming and labor-intensive. But on the other hand, the generation of the non-conforming product map is based on the scanning results of the automatic quality inspection. Simply canceling the automatic quality inspection will result in t...

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Abstract

The invention relates to a method and a device for generating a semiconductor encapsulation unqualified product map. According to the embodiment, the method for generating the semiconductor encapsulation unqualified product map comprises the following steps of reading an unqualified product mark on a conducting wire framework bar so as to recognize the conducting wire framework bar with a flaw encapsulation body; inspecting the position of the flaw encapsulation body on the conducting framework bar with the flaw encapsulation body so as to generate the unqualified product map. All encapsulation products are not precisely scanned, so that the yield of the product can be guaranteed in a high-efficiency and low-cost way, and the unqualified product map can be successfully generated.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a production method and device for semiconductor packaging. Background technique [0002] In the production process of integrated circuit packaging, one of the ways to ensure the qualified rate of products is to screen out the defective products detected in the production process. [0003] Specifically, in each packaging process, such as die bonding or wire bonding, the product inspector will mark the detected unqualified products. After the process is completed, all products including non-conforming products are re-inspected by optical machines to find non-conforming products that were not found by previous manual inspections. The optical machine provides the locations of all rejects together to a processor that generates a map of rejects. According to the non-conforming product map, non-conforming products will be rejected during packaging and segmentation to avoid mixi...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67271H01L22/20
Inventor 王明明张建华魏冬李震宇
Owner ASE (KUNSHAN) INC