A kind of target component and preparation method thereof

A target and component technology, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of weak bonding and low processing temperature, and achieve the effect of good bonding and adhesion ability

Active Publication Date: 2016-10-05
光洋新材料科技(昆山)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The advantage of the soldering bonding method is that the processing temperature is low (usually less than 280°C), and it will not cause subsequent abnormal grain growth of the target, but its disadvantage is that the bonding degree is weak, and the soldering bonding method is suitable for targets with different properties all a little different

Method used

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  • A kind of target component and preparation method thereof
  • A kind of target component and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] see figure 1 , the target assembly of the present invention includes a back plate 1 and a target material 5, the welding surface of the back plate 1 is provided with a back plate solder layer 2 with a low melting point, and the welding surface of the target material 5 is sequentially provided with plasma spraying from the inside to the outside The interface layer 4 and the target material solder layer 3 with a low melting point; the back plate solder layer 2 and the target material solder layer 3 are soldered softly.

[0026] see figure 2 , the preparation method of the target assembly of the present invention includes the following steps:

[0027] (1) Coat the backplane solder layer 2 on the soldering surface of the backplane 1, and heat the backplane solder layer 2 into a molten state (the melting point of indium is 156.6° C.). The backplane solder layer 2 is composed of low melting point solder, the material of the backplane 1 is selected from copper, and the mate...

Embodiment 2

[0034] The difference from Embodiment 1 is that the material of the plasma sprayed interface layer 4 is aluminum oxide. The test result is: the tensile strength of the target assembly is 30-35kg / cm2.

Embodiment 3

[0036] The difference from Example 1 is that the welding surface of the target 5 is polished with 800 mesh sandpaper. The test result is: the tensile strength of the target assembly is 35-40kg / cm2.

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Abstract

The invention discloses a target assembly and a preparation method thereof. The target assembly comprises a back plate and a target material, wherein a welding surface of the back plate is provided with a back plate welding material layer with low melting point; the welding surface of the target material is sequentially provided with a plasma spraying interface layer and a low-melting-point target material welding material layer from inside to outside; the back plate welding material layer is flexibly connected with the target material welding material layer in a welding manner. The preparation method of the target assembly comprises the following steps of coating the welding surface of the back plate with the back plate welding material layer, and heating the back plate welding material layer to be molten; grinding the welding surface of the target material by utilizing a piece of sand paper; spraying the plasma spraying interface layer on the ground surface of the target material by utilizing a plasma spraying method; coating the plasma spraying interface layer with the target material welding material layer after the plasma spraying interface layer is dropped, and heating the target material welding material layer to be molten; flexibly welding the back plate welding material layer at the molten state on the back plate with the target material welding material layer at the molten state on the target material. By adopting the target assembly and the preparation method thereof, the joint attachment capacity of the target assembly is excellent.

Description

technical field [0001] The invention relates to a target component and a preparation method thereof, belonging to the technical field of tool and mold coating. Background technique [0002] At present, the method of soldering is mostly used for the target material. When the welding process of the target material is carried out in the industry, the most commonly used method is the soldering process with the backplane. The solder used is indium (In) with a low melting point or Tin (Sn) material. [0003] The advantage of the soldering bonding method is that the processing temperature is low (usually less than 280°C), and it will not cause subsequent abnormal grain growth of the target, but its disadvantage is that the bonding degree is weak, and the soldering bonding method is suitable for targets with different properties All are a little different. Contents of the invention [0004] Aiming at the deficiencies in the prior art, the purpose of the present invention is to p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34B23K1/00B23K1/20
Inventor 陈俊杰黄威智方家芳
Owner 光洋新材料科技(昆山)有限公司
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