Method for drilling rolled flexible printed circuit board

A flexible circuit board, roll-shaped technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of polluting products, machines or work areas, increasing costs, and copper foil material products are prone to wrinkles, etc., to save laser processing time. Effect

Inactive Publication Date: 2014-04-16
杨秀英
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0002] When processing blind holes or through holes with roll-to-roll laser, because the product needs to follow the laser machine platform to move at high speed, the copper foil material product is prone to wrinkles. At the same time, some waste materials generated after laser processing are also prone to drift or splash, thus contaminating the product. , machines or work areas; the waste remaining on the product has to be eliminated by other processes, increasing costs

Method used

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  • Method for drilling rolled flexible printed circuit board
  • Method for drilling rolled flexible printed circuit board

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Embodiment Construction

[0022] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0023] A method for rolling holes in a flexible circuit board 1, comprising the following steps: (1) attaching a layer of carrier film 4 to one side of a roll-shaped raw material; The raw materials are used to make holes; (3) The above-mentioned carrier film 4 is torn off to make a flexible circuit board 1 with holes.

[0024] An adhesive layer 3 is provided between the roll-shaped raw material and the carrier film 4. In order to prevent the copper foil from wrinkling during processing, and the carrier film 4 is easy to tear off, the thickness of the adhesive layer 3 is preferably 0.5-50um; The junction layer 3 is composed of weakly cohesive polypropylene adhesive or epoxy adhesive.

[0025] The raw materials are composed of: single-layer flexible circuit board 1; the raw materials can also be composed of: multi-layer flexible circuit bo...

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PUM

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Abstract

The invention discloses a method for drilling a rolled flexible printed circuit board. The method comprises the following steps of 1 bonding a bearing film on one side of a rolled raw material; 2 using a laser machining machine to perform hole drilling on the rolled raw material bonded with the bearing film; 3 tearing off the bearing film and obtaining the flexible printed circuit board with holes. In the machining process by adopting the method, all of through holes can be directly subjected to shape cutting, residual copper foil materials are left on the bearing film 4 for saving the laser machining time, residues after laser machining can be directly stripped and removed with the bearing film 4. In addition, the flexible printed circuit board is required to move with a laser machine platform at high speed, copper foils are not draped, the production efficiency is improved, the cost is reduced, and the production quality is ensured.

Description

technical field [0001] A method for making holes, in particular a method for making holes in a flexible circuit board. Background technique [0002] When processing blind holes or through holes with roll-to-roll laser, because the product needs to follow the laser machine platform to move at high speed, the copper foil material product is prone to wrinkles. At the same time, some waste materials generated after laser processing are also prone to drift or splash, thus contaminating the product. , machines or work areas; the waste remaining on the product must be eliminated by other processes, increasing costs. The prior art has not solved this problem. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the object of the present invention is to provide a method for rolling holes in a flexible circuit board that can easily remove the processed waste, and the flexible circuit board uses copper foil material without wrinkling. [0004] In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 杨秀英
Owner 杨秀英
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