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power conversion device

A technology of power conversion device and alternating current, which is applied in the direction of power consumption device, output power conversion device, control device, etc., can solve the problem of large-scale converter, and achieve the effect of reducing the size

Active Publication Date: 2016-04-06
HITACHI ASTEMO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, according to the invention described in Japanese Unexamined Patent Application Publication No. 2008-193867, there is a problem that the overall size of the inverter (especially in the height direction) is enlarged.

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Embodiment Construction

[0044] According to the invention described in Japanese Patent Application Laid-Open No. 2008-193867, an opening for inserting a semiconductor module is provided on the upper surface of the water channel housing. This creates a need to provide a certain amount of space in the height direction of the semiconductor module, and as a result, the overall size of the inverter (especially in the height direction) increases. By providing the opening for inserting the semiconductor module on the side surface of the water channel housing, it is possible to reduce the size of the components of the power conversion device, improve the manufacturability and assemblability, and achieve cost reduction. It is an object of the present invention to provide a power conversion device capable of downsizing (lower profile) and cost reduction with respect to conventional power conversion devices. Embodiments according to the invention will be described using the drawings.

[0045] figure 1It is a ...

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Abstract

The power conversion device includes a power semiconductor module, a smoothing capacitor module, an AC bus, a control circuit unit for controlling the power semiconductor element, and a flow path forming body for forming a flow path through which a refrigerant flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion, and the flow path forming body outer shape portion of the flow path forming body has a A first surface wall facing the heat dissipation part, a second surface wall facing the second heat dissipation part across the flow path, and a side wall connecting the first surface wall and the second surface wall, the side wall There is an opening for inserting the power semiconductor module into the flow path.

Description

technical field [0001] The present invention relates to a power conversion device for converting DC power into AC power or converting AC power into DC power. Background technique [0002] An example of the power conversion device is disclosed in Japanese Patent Laid-Open No. 2008-193867. [0003] Japanese Unexamined Patent Publication No. 2008-193867 discloses a configuration in which a semiconductor module has cooling metals on both sides thereof, and a semiconductor chip for an upper arm and a semiconductor chip for a lower arm are sandwiched between the cooling metals. Insert the semiconductor module into the main body of the water channel housing. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese Patent Laid-Open No. 2008-193867 [0007] Summary of the invention [0008] The problem to be solved by the invention [0009] However, according to the invention described in Japanese Patent Application Laid-Open No. 2008-193867,...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/00B60L50/16
CPCH02M7/003H05K7/20927B60L2210/40B60L3/003B60L3/0061B60L15/007B60L15/2009B60L2220/14B60L2240/36B60L2240/423B60L2240/443B60L2240/525B60L2270/145Y02T10/70H01L2224/33H01L2224/48247H01L2224/73265B60L50/40B60L50/16H01L2924/13055H01L2924/13091Y02T10/64Y02T10/72Y02T10/7072H01L2224/48472H01L2224/33181H05K7/14322H01L2924/00H05K7/2089H05K7/20945H05K7/20218H05K7/1432H05K7/209
Inventor 桑野盛雄原阳成浜田晴喜
Owner HITACHI ASTEMO LTD