A kind of ingot casting method of granular polycrystalline silicon
A polysilicon and granular technology, applied in the growth of polycrystalline materials, chemical instruments and methods, crystal growth, etc., to achieve the effects of convenient implementation, simple processing steps, and low input costs
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Embodiment 1
[0058] like figure 1 The ingot casting method of a kind of granular polysilicon shown, comprises the following steps:
[0059] Step 1, charging: the granular polysilicon 1 is loaded into the crucible as the silicon material for ingot casting.
[0060] like image 3 As shown, after the charging in step 1 is completed, the charging structure in the crucible includes the granular polysilicon 1 filled in the crucible, the pad between the inner wall of the crucible and the granular polysilicon 1 A layer of edge protection 2 formed by assembling block polysilicon and a cover top 3 formed by assembling block polysilicon on the granular polysilicon 1, the cover top 3 is located in the edge protection 2; after the charging is completed , the silicon material in the crucible includes granular polysilicon 1 , edge guard 2 and roof 3 .
[0061] In this embodiment, the crucible is placed flat on the horizontal base plate 6, and the outer guard plate 7 for limiting the quartz crucible 1 ...
Embodiment 2
[0133] In this embodiment, the difference from Example 1 is that: before charging in step 1, a layer of 20mm thick silicon chips is laid on the bottom of the crucible to form a pavement layer 4 of silicon chips; In the tenth step, keep the 5mm thick broken silicon chips in the broken silicon chip pavement layer 4 without melting; in the second step, the preheating time is 6h and T1=1185°C, P1=80kW; in the third step, T5=1560°C, t=18min, Q1=650mbar; in the first step, the holding time is 0.4h; in the second to fifth steps, T2=1210℃, and the heating time is 0.4h; in the sixth step, T3=1460℃, and the heating time is 260min ; In the seventh step, T4=1510°C and the heating time is 260min; in the eighth step, T5=1560°C and the heating time is 260min; in the ninth step, the holding time is 3.5h; in the tenth step, the holding time is 4h.
[0134] In the present embodiment, when heating up and pressurizing in the 2nd step to the 5th step, the process is as follows:
[0135] The seco...
Embodiment 3
[0145] In this embodiment, the difference from Example 1 is that before charging in step 1, a layer of 25mm thick silicon fragments is laid on the bottom of the crucible to form a pavement layer 4 of silicon fragments; In the 10th step, keep the 20mm thick silicon fragments in the pavement layer 4 of the fragmented silicon fragments without melting; in the second step, the preheating time is 10h and T1=1165°C, P1=70kW; in the third step, T5=1540°C, t=22min, Q1=550mbar; the holding time in step 1 is 0.6h; from step 2 to step 5, T2=1190℃, heating time is 0.6h; in step 6, T3=1440℃ and heating time is 280min ; In the seventh step, T4=1490°C and the heating time is 280min; in the eighth step, T5=1540°C and the heating time is 280min; in the ninth step, the holding time is 4.5h; in the tenth step, the holding time is 8h.
[0146] In the present embodiment, when heating up and pressurizing in the 2nd step to the 5th step, the process is as follows:
[0147] The second step, the fir...
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