A kind of ingot casting method for silicon powder purification
A technology for casting ingots and silicon powder is applied in the field of ingots for purification of silicon powder to improve the quality of crystal growth, ensure conversion efficiency, and achieve the effect of convenience.
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Embodiment 1
[0058] Such as figure 1 Shown a kind of silicon powder purification uses the ingot casting method, comprises the following steps:
[0059] Step 1, charging: put the silicon cake 1 formed by pressing silicon powder into the crucible as the silicon material for ingot casting.
[0060] In this embodiment, the silicon powder is pressed into a silicon cake 1, and the pressure of the cake press machine used is 300 tons, so that the loose silicon powder is pressed into a silicon cake with a certain density, and a package of 5KG is convenient for lifting and loading. quantity.
[0061] Such as image 3 As shown, after the charging in step 1 is completed, the charging structure in the crucible includes a silicon cake 1 filled in the crucible, and a layer between the inner wall of the crucible and the silicon cake 1. The edge protection 2 formed by assembling block polysilicon and the cover top 3 formed by assembling block polysilicon on the silicon cake 1 are covered, and the cover ...
Embodiment 2
[0134] In this embodiment, the difference from Example 1 is that: before charging in step 1, a layer of 20mm thick silicon chips is laid on the bottom of the crucible to form a pavement layer 4 of silicon chips; In the tenth step, keep the 5mm thick broken silicon chips in the broken silicon chip pavement layer 4 without melting; in the second step, the preheating time is 6h and T1=1185°C, P1=80kW; in the third step, T5=1560°C, t=18min, Q1=650mbar; in the first step, the holding time is 0.4h; in the second to fifth steps, T2=1210℃, and the heating time is 0.4h; in the sixth step, T3=1460℃, and the heating time is 5h ; In the seventh step, T4=1510°C and the heating time is 5h; in the eighth step, T5=1560°C and the heating time is 5h; in the ninth step, the holding time is 3.5h; in the tenth step, the holding time is 4h.
[0135] In the present embodiment, when heating up and pressurizing in the 2nd step to the 5th step, the process is as follows:
[0136] The second step, the...
Embodiment 3
[0146] In this embodiment, the difference from Example 1 is that before charging in step 1, a layer of 25mm thick silicon fragments is laid on the bottom of the crucible to form a pavement layer 4 of silicon fragments; In the tenth step, keep the 20mm thick broken silicon chips in the broken silicon chip pavement layer 4 without melting; in the second step, the preheating time is 10h and T1=1165°C, P1=70kW; in the third step, T5=1540°C, t=22min, Q1=550mbar; in the first step, the holding time is 0.6h; in the second to fifth steps, T2=1190℃, and the heating time is 0.6h; in the sixth step, T3=1440℃, and the heating time is 7h ; In the seventh step, T4=1490°C and the heating time is 7h; in the eighth step, T5=1540°C and the heating time is 7h; in the ninth step, the holding time is 4.5h; in the tenth step, the holding time is 8h.
[0147] In the present embodiment, when heating up and pressurizing in the 2nd step to the 5th step, the process is as follows:
[0148] The second ...
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