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The wiring structure of the array substrate

An array substrate and line structure technology, applied in nonlinear optics, optics, instruments, etc., can solve the problems of increasing electrostatic discharge at the peripheral intersection, increasing the layout space of the array substrate, increasing the product yield, etc. risk, reduce the number of solidified buses, and increase the effect of design space

Active Publication Date: 2016-06-29
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0010] It can be seen that seven traces will increase the typesetting space of the array substrate design. Under the condition of a fixed glass substrate size, the more traces are required, the smaller the design space; and too many traces, the more intersections, and the increase The risk of electrostatic discharge (ESD, Electronic Static Discharge) at peripheral intersections increases the risk of product yield loss

Method used

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  • The wiring structure of the array substrate
  • The wiring structure of the array substrate
  • The wiring structure of the array substrate

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Embodiment Construction

[0034] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0035] figure 2 It shows the arrangement of red lines 14 , green lines 15 , blue lines 16 , odd lines 17 and even lines 18 of the wiring structure of the vertical alignment liquid crystal panel in the prior art. It can be seen that in the prior art, the red line 14 , the green line 15 , the blue line 16 , the odd line 17 and the even line 18 are five independent lines that receive voltage individually.

[0036] refer to figure 2 After research, the applicant thinks that during the curing process, the red line 14, the green line 15 and the blue line 16 only need to withstand the same amount of voltage at the same moment. Similarly, the odd-numbered lines 17 and the even-numbered lines 18 only need to withstand the same amount of voltage at the same time. Therefore, during the curing process, the red line 14, the green line 15, and the blue line 16 do not nee...

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PUM

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Abstract

A wiring structure of an array substrate relates to the technical field of liquid crystal display, wherein comprised are a red, green and blue line (21) used as a data line in a curing process, an odd and even number line (22) used as a scan line in the curing process, an array substrate common line (20), a color film substrate common line (23), and, correspondingly, a red, green and blue line curing pad (21-1), an odd and even number curing pad (22-1), an array substrate curing pad (20-1) and a color film substrate curing pad (23-1) that are connected to the red, green and blue line (21), the odd and even number line (22), the array substrate common line (20) and the color film substrate common line (23) respectively and are used for receiving a voltage. Through improvement on prior art, a number of curing buses is reduced, thus peripheral wiring of the array substrate is reduced, buffer space of design and layout is increased, and a risk that a poor process occurs is also reduced.

Description

technical field [0001] The present invention relates to the field of liquid crystal display technology, in particular to a wiring structure of an array substrate. Background technique [0002] With the development of the information society, people's demand for display equipment has increased, which has also promoted the rapid development of the LCD panel industry. The demand for panels is also increasing rapidly, and the requirements for product quality are also getting higher and higher. Process capability also puts forward higher requirements. [0003] Generally, in the design of the thin film transistor liquid crystal display (TFTLD) array substrate of the polymer stabilized vertical alignment (PSVA) process, there is a wiring structure for the curing line, so that the array test pad (Arraytestpad) and the curing pad (curingpad) ) connected, the array test pad (Arraytestpad) is used for panel electrical inspection after the array substrate process is completed, and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/133711G02F1/136286G02F1/1368H01L27/124
Inventor 柴立
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD