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Heat dissipation substrate for encapsulating power module

A heat dissipation substrate and power module technology, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., to achieve the effect of improving heat dissipation, increasing service life and reliability

Inactive Publication Date: 2014-05-07
嘉兴斯达微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, insulated gate bipolar transistor (IGBT) modules, also known as power modules, are more and more widely used in inverters, inverter welding machines, induction heating, rail transit, wind energy, solar power and other fields, but the existing power modules In the actual use process, the heat dissipation problem of the power module is encountered, that is, the heat dissipation of the power module plays a key role in the reliability of the power module, especially the development of the current technology, the reliability of the applied power module in terms of structure and circuit more demanding

Method used

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  • Heat dissipation substrate for encapsulating power module
  • Heat dissipation substrate for encapsulating power module
  • Heat dissipation substrate for encapsulating power module

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Embodiment

[0019] As shown in the figure, the thickness of the substrate 1 is between 1-10 mm; the area of ​​the substrate 1 is between 0.01-0.5 square meters; the heat dissipation pin 2 is made of pure copper, copper alloy, pure aluminum, aluminum alloy One of the materials, its shape is one of cylinder, truncated cone, cube or rectangle, and the height of the cooling pin 2 is between 2-50 mm.

[0020] The substrate 1 and the cooling pin 2 are connected by welding. The welding uses Sn-containing welding materials in SnPb, SnAg, SnAgCu, and PbSnAg. The maximum welding temperature is controlled between 100-400°C.

[0021] The connection between the base plate 1 and the heat dissipation pin 2 is through press fit.

[0022] The substrate 1 and the cooling pin 2 are connected by ultrasonic welding.

[0023] The base plate 1 and the cooling pin 2 are molded by integral casting.

[0024] The base plate 1 and the cooling pin 2 are integrally formed by forging.

[0025] The base plate 1 and t...

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Abstract

A heat dissipation substrate for encapsulating a power module comprises a substrate made of pure copper or copper alloy or pure aluminum or aluminum alloy, and heat dissipation needles are fixedly connected on the surface of the substrate by adopting a soldered joint method or an ultrasonic soldering method or an integral press fit method or an integral casting method or an integral forging method. The thickness of the substrate is 1-10mm, and the area of the substrate is 0.01-0.5sqm. The heat dissipation needles are made of pure copper or copper alloy or pure aluminum or aluminum alloy, and are in the shape of a cylinder or a circular truncated cone or a cube or a rectangle, and the height of the heat dissipation needles is 2-50mm. The heat dissipation substrate for encapsulating the power module can improve heat dissipation capacity of a traditional module, prolong the service life of the power module, and improve the reliability of the power module.

Description

technical field [0001] The invention relates to a heat dissipation substrate for power module packaging, which belongs to the technical field of power module packaging in power electronics. Background technique [0002] At present, insulated gate bipolar transistor (IGBT) modules, also known as power modules, are more and more widely used in inverters, inverter welding machines, induction heating, rail transit, wind energy, solar power and other fields, but the existing power modules In the actual use process, the heat dissipation problem of the power module is encountered, that is, the heat dissipation of the power module plays a key role in the reliability of the power module, especially the development of the current technology, the reliability of the applied power module in terms of structure and circuit more demanding. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcomings of the prior art, and provide a heat...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/13
Inventor 姚礼军
Owner 嘉兴斯达微电子有限公司
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