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An integral overlay button

An overall coverage and button technology, applied in the field of keyboard buttons, can solve the problems of increased process cost, complex structure, low sensitivity, etc., and achieve the effect of reducing assembly process, facilitating surface cleaning and wide application

Active Publication Date: 2016-11-16
BEIGU NEW MATERIAL TECH SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the PVDF piezoelectric film is used in the above-mentioned patent, and its sensitivity (piezoelectric charge coefficient d33 is about 25pC / N) is low, and its high cost has become the main reason for its limited application.
In addition, the above-mentioned patent adopts the method of separating the piezoelectric film from the FPC lead-out line, which not only has a complicated structure, but also increases the process cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1: Combination figure 1 , An integral cover button, including a piezoelectric electret film 1, an upper surface electrode 3 attached to the upper surface of the piezoelectric electret film 1, and a lower surface electrode 2 attached to the lower surface of the piezoelectric electret film 1. , The upper surface encapsulation layer 11 and the lower surface encapsulation layer 4 encapsulated on the outer layer of the upper surface electrode 3 and the lower surface electrode 2, the surface layer 8 located on the upper surface encapsulation layer, and the upper surface encapsulation layer 11 connected to the support surface The upper surface of the layer 8 supports the framework 6, the shielding layer 5 attached to the outer layer of the lower surface encapsulation layer 4, the base layer 9 at the bottom layer, and the lower surface support framework 7 connected with the base layer 9 to support the above structure.

[0027] The piezoelectric electret film 1 (also called ...

Embodiment 2

[0034] Example 2: Another implementation of the present invention. The overall layered structure is the same as that of Example 1, except that:

[0035] The lower surface electrode 2, such as image 3 As shown, it is composed of two groups of conductive electrode groups arranged in a longitudinal direction, and each conductive electrode group is formed by connecting three conductive electrodes 21 arranged in a horizontal direction in series, and each conductive electrode group is led out by a wire 22 respectively.

[0036] The upper surface electrode 3, such as Figure 5 As shown, it is composed of 3 groups of conductive electrode groups arranged horizontally, and each conductive electrode group is formed by two conductive electrodes 31 arranged in series in a longitudinal direction, and each conductive electrode group is led out by a wire 32 respectively.

Embodiment 3

[0037] Embodiment 3: Another embodiment of the present invention is to modify the structure of the upper surface electrode 3 on the basis of Embodiment 1 or Embodiment 2 to consist of a whole piece of conductive electrode 31, which is led out by a wire 32, such as Image 6 As shown, and the coverage area of ​​the upper surface electrode 3 ≥ the coverage area of ​​the lower surface electrode 2.

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Abstract

The invention discloses an integrally covering-layer key. The integrally covering-layer key includes a piezoelectric electret film, upper surface electrodes which are attached to the upper surface of the piezoelectric electret film, lower surface electrodes which are attached to the lower surface of the piezoelectric electret film, an upper surface encapsulation layer which is encapsulated on the outer layers of the upper surface electrodes, a lower surface encapsulation layer which is encapsulated on the outer layers of the lower surface electrodes, a surface layer which is located on the upper surface encapsulation layer, and upper surface supporting frames which are connected with the upper surface encapsulation layer and are used for supporting the surface layer, a shielding layer which is attached to the outer layer of the lower surface encapsulation layer, a base layer which is located at a bottom layer, and lower surface supporting frames which are connected with the base layer and are used for supporting the above structures. The integrally covering-layer key of the invention is advantageous in no need for slotting performed on each key region, simple structure, reduced assembly processes and decreased production cost.

Description

Technical field [0001] The present invention relates to the technical field of keyboard keys, in particular to an integral covering layer key. Background technique [0002] The button mentioned in this article refers to the button used to control whether a circuit has electrical signal generation or the flow direction and size of the electrical signal. The most common form of expression is a switch. [0003] Existing buttons can be divided into: separate buttons and integral buttons; the separate buttons have separation or gaps between the button areas, including: separate buttons such as mechanical and silicone buttons; Mobile phones, computer keyboards and other household and personal digital product keys are widely used, but they have shortcomings such as easy wear, short life, large volume, and complex structure, and are gradually replaced in modern household appliances and digital products. [0004] The integral keys include: membrane keys, capacitive keys, and PVDF piezoelectr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03K17/96
Inventor 李彦坤孟召龙赵俊飞刘玲张晓青
Owner BEIGU NEW MATERIAL TECH SHANGHAI