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Multilayer wiring substrate

A multi-layer wiring substrate and insulating layer technology, applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuit components, etc., can solve the problem of inability to obtain adhesion, and achieve the effect of preventing peeling

Inactive Publication Date: 2014-05-14
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, at the conduction conductor, the sealing body filled inside cannot obtain sufficient adhesion.

Method used

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  • Multilayer wiring substrate
  • Multilayer wiring substrate
  • Multilayer wiring substrate

Examples

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Embodiment Construction

[0031] Hereinafter, an embodiment in which the present invention is embodied in a multilayer wiring board will be described in detail with reference to the drawings.

[0032] Such as figure 1 As shown, the multilayer wiring substrate 10 of the present embodiment includes a core substrate 11, a core main surface 12 formed on the core substrate 11 ( figure 1 The first buildup layer 31 on the upper surface) and the core back surface 13 formed on the core substrate 11 ( figure 1 The middle is the second build-up layer 32 on the lower surface).

[0033] The core substrate 11 is constituted by, for example, a resin insulating material (glass epoxy resin material) obtained by impregnating glass fiber cloth as a reinforcing material with epoxy resin. Conduction holes 15 (through holes) penetrating through the core substrate 11 in the thickness direction are formed at a plurality of locations on the core substrate 11 , and via conductors 16 are formed in the conduction holes 15 . ...

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Abstract

Provided is a multilayer wiring substrate capable of sufficiently ensuring adhesion strength between a conformal conductor and a resin insulation layer. This multilayer wiring substrate (10) has a multilayer structure comprising multiple resin insulation layers (33-38) and multiple conductor layers (42) laminated alternately. Inside of via holes (53) formed in the resin insulation layers (33, 34), conformal via conductors (54) are formed that electrically connect the conductors (42). Inside of the conformal via conductors (54), an anchor part (58) is formed by filling with a portion of the resin insulation layer (35, 36) laminated on the upper layer side. The lower end of the anchor part (58) expands further than the upper end outwards in the radial direction of the via holes (53).

Description

technical field [0001] The present invention relates to a multilayer wiring board having a multilayer structure in which a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. Background technique [0002] In recent years, along with miniaturization of electric equipment, electronic equipment, etc., miniaturization and high density of multilayer wiring boards mounted on these equipment are also required. As such a multilayer wiring board, there is practically used a wiring board manufactured by the so-called build-up method (for example, refer to Patent Documents 1, 2). In the multilayer wiring board, the lower conductor layer and the upper conductor layer of the resin insulating layer are connected via via conductors formed in the resin insulating layer. [0003] As via conductors for connecting the conductor layers, there are filled via conductors and conformal via conductors. The filled via conductor refers to a type of vi...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/421H05K3/4644H05K2201/09509H05K2201/0959H05K2201/2072H05K2201/029H05K1/02
Inventor 前田真之介
Owner NGK SPARK PLUG CO LTD
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