Multilayer wiring substrate
A multi-layer wiring substrate and insulating layer technology, applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuit components, etc., can solve the problem of inability to obtain adhesion, and achieve the effect of preventing peeling
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[0031] Hereinafter, an embodiment embodying the present invention as a multilayer wiring board will be described in detail with reference to the drawings.
[0032] Such as figure 1 As shown, the multilayer wiring board 10 of the present embodiment includes a core substrate 11, and a core main surface 12 formed on the core substrate 11 ( figure 1 The middle is the upper surface) on the first build-up layer 31 and the core back surface 13 ( figure 1 The middle is the second build-up layer 32 on the lower surface.
[0033] The core substrate 11 is composed of, for example, a resin insulating material (glass epoxy material) in which epoxy resin is impregnated with glass fiber cloth as a reinforcing material. Conductive holes 15 (through holes) penetrating the core substrate 11 in the thickness direction are formed in a plurality of locations of the core substrate 11, and conductive conductors 16 are formed in the conductive holes 15. The via conductor 16 connects the core main surfa...
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