Batch type substrate processing equipment

Abstract

PROBLEM TO BE SOLVED: To provide an improved batch type substrate processing device.SOLUTION: A batch type substrate processing device (100) which contains a boat (200) for loading plural substrates (10) while the substrates are vertically laminated in horizontal position so as to be spaced from one another at a predetermined interval has a ring holder (300) on which the plural substrates are mounted and supported from the bottom surface, plural support rods (260) which project from the vertical frames (220, 240) of the boat so as to be vertically spaced from one another at a predetermined interval so that the ring holder is mounted and supported from the bottom surface, and an end effector (400) which has such a shape as to enter a space above the support rods in the boat and outside the ring holder and loads and / or unloads the substrates into / from the boat in a bottom-lift style while supporting the substrates from the bottom surface.

Description

technical field [0001] The present invention relates to a batch processing type substrate processing device. More specifically, it relates to a batch type substrate processing apparatus capable of loading / unloading substrates mounted on a ring holder using a bottom-lift type end effector. Background technique [0002] The substrate processing apparatus is roughly divided into a vapor deposition (Vapor Deposition) apparatus and an annealing (Annealing) apparatus. [0003] Vapor deposition devices are devices that form transparent conductive layers, insulating layers, metal layers or silicon layers that constitute the core structure of semiconductors, and are divided into LPCVD (Low Pressure Chemical Vapor Deposition: Low Pressure Chemical Vapor Deposition) or PECVD (Plasma-Enhanced Chemical Vapor Deposition) : Chemical vapor deposition equipment such as plasma enhanced chemical vapor deposition) and physical vapor deposition equipment such as sputtering (Sputtering). [000...

AI Technical Summary

Problems solved by technology

[0012] However, in the existing batch-type substrate processing apparatus, the bottom space of the substrate 10 is closed to prevent the entry of the end effector 40. By exposing only the upper space of the substrate 10, the top edge clamping type end effector 40 is used for loading / unloading, causing the spacing P between the substrates 10 to become larger

Specifically, the top edge clamping type end effector 40 must ensure a minimum working space a for clamping both ends of the substrate 10 in order to descend from the upper portion of the substrate 10, so such a restriction enlarges the pitch P, resulting in a loadable Due to the reduction in the number of substrates 10 in the wafer boat 20

[0013] In addition, the top edge gripping type end effector 40 has a complicated structure for gripping the substrate 10, and passes through a step in which the end effector 40 enters the wafer boat 20, a step in which the end effector 40 descends to grip the substrate 10, and an end effector 40 step. The step where the actuator 40 goes up to unload the substrate 10, so the process time increases

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