Composite stackup covering film, circuit board provided with covering film and manufacturing method thereof
A composite, covering film technology, used in printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of uneven filling, short service life and thick thickness of the covering film, and achieve good inter-line impedance value. , The effect of destroying high voltage and high mechanical properties
Inactive Publication Date: 2014-05-21
KUSN APLUS TEC CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
These known cover films have the defects of thicker thickness, uneven filling, and short service life of the cover film itself.
Method used
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[0024] Example: such as figure 1 A kind of composite lamination covering film shown is composed of a primary color polyamideimide film 2 directly formed on the surface of the formed circuit substrate 1 and a black polyamideimide film directly formed on the surface of the primary color polyamideimide film. The imine membrane 3 constitutes.
[0025] The primary-color polyamide-imide film 2 is a liquid-baked primary-color polyamide-imide film formed by spraying the liquid precursor composition of polyamide-imide on the surface of the formed circuit substrate 1 and baking.
[0026] The black polyamide-imide film 3 is a liquid baked product formed by spraying a liquid precursor composition of polyamide-imide mixed with a black substance on the surface of the primary-color polyamide-imide film 2 and baking. Baked-type black polyamideimide membrane.
[0027] Preferably, the thickness of the primary color polyamide-imide film is 10-15 microns.
[0028] Preferably, the thickness of ...
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Abstract
A composite stackup covering film is composed of a primary-color polyamide imide film directly formed on the surface of a formed circuit substrate and a black polyamide imide film directly formed on the surface of the primary-color polyamide imide film. The primary-color polyamide imide protection film has an excellent electrical characteristic, a high line impedance value, high plague voltage, high mechanical characteristic, high tensioning resistance, high elongation and high elastic modulus. The black polyamide imide protection film has excellent light resistant effect and covering performance. Release paper is not needed in the production process of the composite stackup covering film, and the composite stackup covering film has the superiority of paperless environmental protection and further has the advantages of having excellent glass transition temperature characteristic and flexibility. A flexible printed circuit board provided with the covering film is suitable for mobile phones, digital cameras, digital video cameras, tablet personal computers and the like.
Description
technical field [0001] The invention relates to a liquid yellow PAI protective film baked at low temperature and a liquid black PAI protective film, in particular to two ultra-thin composites for highly flexible printed circuit boards that are directly sprayed on the surface of FPC Laminated PAI protective film. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing. Due to the flexible printed circuit board (FPC, Flexible Printed Circuit) has the characteristics of flexibility and three-dimensional space wiring, under the development trend of technological electronic products emphasizing lightness, shortness and flexibility, it is currently widely used. Applications of computers and their peripherals, communications products, consumer electronics, and more. [0003] Generally speaking, a flexible printed circuit boa...
Claims
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Login to View More IPC IPC(8): H05K1/02B32B27/28H05K3/00
Inventor 梅爱芹陈辉林志铭李建辉
Owner KUSN APLUS TEC CORP