Multifunctional single-chip bonder

Abstract

The invention discloses a multifunctional single-chip bonding mechanical arm. The multifunctional single-chip bonding mechanical arm comprises a mechanical arm claw, a microscopic visual part, an X-Y-Z axis motion platform, a rotating shaft motion platform and a supporting body, wherein the X-Y-Z axis motion platform is a three-dimensional coordinate motion mechanism and used for driving the microscopic visual part and the mechanical arm claw to do three-dimensional motion, the rotating shaft motion platform is connected with a Z-axis of the X-Y-Z axis motion platform and used for driving the mechanical arm claw to achieve rotating motion, the mechanical arm claw is located below the rotating shaft motion platform and used for achieving chip grabbing, the microscopic visual part is connected with the Z-axis of the X-Y-Z axis motion platform and used for achieving chip pose capturing so as to provide chip pose information for the mechanical arm claw, and the supporting body is used for supporting the X-Y-Z axis motion platform. By means of the multifunctional single-chip bonding mechanical arm, technology difficulty and requirements for the quality of workers are reduced, and integral bonding quality and the yield are improved.

Description

technical field [0001] The invention relates to the technical field of MEMS assembly and packaging, in particular to a multifunctional single-chip bonding operator. Background technique [0002] With the development of MEMS technology, in order to meet the high-performance, diversified and small-batch market demand, MEMS sensor packaging is gradually developing from wafer-wafer level to wafer-chip level and chip-chip level. A single application The current anodic bonding, adhesive, and eutectic bonding processes have gradually failed to meet the needs of the development of high-performance chip packaging, and various energy fields such as ultrasound, plasma, laser, and UV light have gradually merged with traditional bonding methods , forming a composite bond. [0003] The current composite bonding is completed by distributing multiple process steps on different equipment. This step-by-step process method on different equipment has the following problems: [0004] First, hi...

AI Technical Summary

Problems solved by technology

[0004] First, high equipment costs are required;

[0005] Second, the process is difficult, and the step-by-step process transfer process cannot be accurately controlled, which adds uncontrollable factors to the bonding quality and performance;

[0006] Third, the requirements for the skills of operators increase, which increases the cost of personnel

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