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High-voltage-resistant structure of mutual induction coil printed circuit board

A technology of mutual inductance coils and printed boards, which is applied in directions including printed electrical components, can solve problems such as poor withstand voltage and achieve the effect of enhancing withstand voltage.

Inactive Publication Date: 2014-05-28
竞陆电子(昆山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional mutual induction coil printed board structure can well meet the function and needs of line protection, but the withstand voltage is not good, and can only meet the basic IPC (International Electronics Industry Connection Council): DC500V, 30sec withstand voltage test conditions

Method used

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  • High-voltage-resistant structure of mutual induction coil printed circuit board

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Embodiment

[0011] Embodiment: a high-voltage resistant structure of a mutual induction coil printed board, the outermost circuit surface of the mutual induction coil printed board 1 is covered with a wet film type solder resist ink layer 2 (made of synthetic resin, photoinitiator, color materials, surfactants, fillers and solvents), the outermost circuit of the mutual induction coil printed board has a plug-in hole 11, and the wet film type solder resist ink layer has an opening corresponding to the position of the plug-in hole The window part 21, the plug-in hole of the outermost circuit is exposed to the outside at the window part of the wet film type solder resist ink layer, and the surface of the wet film type solder resist ink layer is fixedly attached with a copper-free substrate 3 , the copper-free substrate has a grooved portion 31 corresponding to the plug-in hole and the window portion, the plug-in hole is exposed to the outside at the grooved portion of the copper-free substrat...

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PUM

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Abstract

The invention discloses a high-voltage-resistant structure of a mutual induction coil printed circuit board. A wet film type solder-resistant ink layer with the thickness of 0.035mm-0.01mm covers the surface of a circuit on the outmost layer of the mutual induction coil printed circuit board; a copper-free baseplate with the thickness of 0.05mm-0.15mm is fixedly attached onto the surface of the wet film type solder-resistant ink layer; the wet film type solder-resistant ink layer and the copper-free baseplate are respectively provided with a windowing part and a grooving part corresponding to plug-in holes of the circuit on the outmost layer, and the plug-in holes are exposed out of the windowing parts and the grooving parts. Due to the adoption of the structure, the voltage resistance of the mutual induction coil printed circuit board is enhanced, and the requirement of a high-voltage insulation test under the conditions of DC1500V, 60sec and 2mA can be met.

Description

technical field [0001] The invention belongs to the field of printed circuit board manufacturing, and in particular relates to a structure capable of enhancing the high voltage resistance of a mutual induction coil printed board. Background technique [0002] The traditional mutual induction coil printed board structure can well meet the function and needs of line protection, but the withstand voltage is not good, and can only meet the basic IPC (International Association of Electronics Industry Connection): DC500V, 30sec withstand voltage test conditions. However, with the advancement of science and technology, the upgrading and replacement of electronic products, the progress of science and technology has higher and higher requirements for printed boards, and the high voltage resistance of mutual induction coil printed boards has also improved, so how to increase the cost without significantly increasing the cost? Significantly improving the high voltage resistance of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/16
Inventor 李泽清
Owner 竞陆电子(昆山)有限公司
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