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Aluminum substrate binding agent and aluminum substrate with same

A technology of aluminum substrate binder and mixture, applied in the direction of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problem that the withstand voltage performance, Tg value and dielectric constant are difficult to meet the market Demand and other issues, to achieve the effect of good dielectric constant, high Tg, high withstand voltage performance

Inactive Publication Date: 2019-04-05
DONGGUAN XIANGSI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance of the aluminum substrate is mainly determined by the bonding layer (insulating layer). Therefore, the key to the production of the bonding agent for the aluminum substrate is to require the produced aluminum substrate to have a good withstand voltage, a high Tg value and a low dielectric constant. , and the performance of the aluminum substrate produced by the existing binder is difficult to meet the market demand in terms of withstand voltage performance, Tg value and dielectric constant

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] An aluminum substrate bonding agent, which includes the following raw materials in parts by weight: 40 parts of polyurethane modified epoxy resin, 30 parts of tung oil modified phenolic resin, 10 parts of high-functionality polyurethane modified acrylate, inorganic powder Body 100 parts, nitrile rubber 20 parts, organosilicon compound 5 parts, imidazole 1 part, curing agent 1 part.

[0025] The surface of the inorganic powder is modified by a silane coupling agent. The modification method is: configure ethanol / water solution with a volume ratio of 4:1, add inorganic powder accounting for 1% of the mass of ethanol / water solution, High-speed shearing at rotating speed, then adding silane coupling agent accounting for 1% of the mass of ethanol / water solution, adding oxalic acid solution to make the pH value of the reaction system at 3, after reacting for 1.5 hours, suction filtration, washing, and drying to obtain surface modification of inorganic powders.

[0026] The in...

Embodiment 2

[0034] An aluminum substrate bonding agent, which includes the following raw materials in parts by weight: 50 parts of polyurethane modified epoxy resin, 35 parts of tung oil modified phenolic resin, 12 parts of high-functionality polyurethane modified acrylate, inorganic powder Body 120 parts, nitrile rubber 25 parts, organosilicon compound 8 parts, imidazole 1.2 parts, curing agent 2 parts.

[0035] The surface of the inorganic powder is modified by a silane coupling agent. The modification method is: configure ethanol / water solution with a volume ratio of 5:1, add inorganic powder accounting for 3% of the mass of ethanol / water solution, High-speed shearing at rotating speed, then adding silane coupling agent accounting for 3% of the mass of ethanol / water solution, adding oxalic acid solution to make the pH value of the reaction system at 3.5, after reacting for 1.8 hours, suction filtration, washing, and drying to obtain surface modification of inorganic powders.

[0036] ...

Embodiment 3

[0044] An aluminum substrate bonding agent, the aluminum substrate bonding agent includes the following raw materials in parts by weight: 60 parts of polyurethane modified epoxy resin, 40 parts of tung oil modified phenolic resin, 15 parts of high-functionality polyurethane modified acrylate, inorganic powder Body 150 parts, nitrile rubber 30 parts, organosilicon compound 10 parts, imidazole 1.5 parts, curing agent 3 parts.

[0045] The surface of the inorganic powder is modified by a silane coupling agent. The modification method is: configure ethanol / water solution with a volume ratio of 6:1, add inorganic powder accounting for 5% of the mass of ethanol / water solution, Shear at high speed at a rotating speed, then add silane coupling agent accounting for 5% of the mass of ethanol / water solution, add oxalic acid solution to make the pH value of the reaction system at 4, react for 2 hours, suction filter, wash, and dry to obtain the surface-modified Inorganic powder.

[0046]...

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Abstract

The invention relates to the technical field of LED aluminum substrates, in particular to an aluminum substrate binding agent and an aluminum substrate with the same. The aluminum substrate binding agent comprises, by weight, 40-80 parts of polyurethane modified epoxy resin, 30-50 parts of tung oil modified phenolic resin, 10-20 parts of high-functionality polyurethane modified acrylate, 100-200 parts of inorganic powder, 20-40 parts of nitrile rubber, 5-15 parts of organosilicon compounds, 1-2 parts of imidazole and 1-5 parts of curing agents. The aluminum substrate binding agent and the aluminum substrate have the advantages that the aluminum substrate prepared from the aluminum substrate binding agent is high in Tg and voltage resistance and excellent in heat conductivity and has a lowdielectric constant; the aluminum substrate is good in flexibility and excellent in machining property and can resist bending, insulation layers are free of cracking after the aluminum substrate is bent, base materials are free of leaking after the aluminum substrate is bent, and hole edges are free of breaking after holes are drilled in plates.

Description

technical field [0001] The invention relates to the technical field of LED aluminum substrates, in particular to an aluminum substrate bonding agent and an aluminum substrate using the bonding agent. Background technique [0002] Aluminum substrate (aluminum-based copper clad laminate) is a metal circuit board material; usually composed of copper foil, bonding layer (insulation layer) and aluminum plate; often used in input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power Amplifiers, switching regulators, DC / AC converters, SW regulators, high-frequency amplifiers, filter appliances, CPU boards, power supply units, power modules, etc., have a wide range of applications. The performance of the aluminum substrate is mainly determined by the bonding layer (insulating layer). Therefore, the key to the production of the bonding agent for the aluminum substrate is to require the produced aluminum substrate to have a good withstand voltage, a high T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/14C09J175/14C09J109/02C09J11/04C09J11/06C09J11/08B32B15/08B32B15/20B32B27/06B32B27/18B32B27/26B32B27/38B32B27/40B32B27/42
CPCB32B15/08B32B15/20B32B27/06B32B27/18B32B27/26B32B27/38B32B27/40B32B27/42B32B2307/20B32B2307/302B32B2307/50B32B2307/546B32B2307/558C08K2003/265C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C08L61/14C08L75/14C08L9/02C08K13/06C08K9/06C08K3/26C08K3/346C08K3/36
Inventor 王振海
Owner DONGGUAN XIANGSI ELECTRONICS TECH CO LTD
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