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Structure of probe station and method of testing wafer by using probe station

A technology for testing wafers and probe stations, which is applied in the field of large-scale integrated circuit testing, can solve problems such as poor test accuracy and poor contact, and achieve the effect of improving accuracy

Active Publication Date: 2014-06-11
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The poor contact between the back of the wafer and the chuck will lead to poor test accuracy, especially for MOSFET products that need to add signals to the chuck

Method used

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  • Structure of probe station and method of testing wafer by using probe station
  • Structure of probe station and method of testing wafer by using probe station
  • Structure of probe station and method of testing wafer by using probe station

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Embodiment Construction

[0015] In order to have a more specific understanding of the technical content, features and effects of the present invention, the detailed description is as follows in conjunction with the illustrated embodiment:

[0016] Such as image 3 As shown, this embodiment adds 4 movable brackets inside the probe station. Since the edge of the TAIKO wafer is thick and the center part is thin, the 4 brackets are placed at the edge of the wafer. At the same time, the top area of ​​the chuck of the probe station is reduced, and how much the upper surface area of ​​the chuck is smaller than the area of ​​the wafer can be determined according to the contact result, and the smallest can be made as small as the chip under test.

[0017] During the test, first pass negative pressure on the upper surface of the four supports, and place the TAIKO wafer on top of the four supports through the robot device inside the probe station, and use the negative pressure to suck the wafer. Then, the wafer foll...

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PUM

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Abstract

Disclosed in the invention is a structure of a probe station. Movable supports are designed inside the probe station and are used for supporting a wafer and driving the wafer for movement; a clamp plate of the probe station is fixed immovably and the upper surface area is larger than or equal to an area of a tested chip and is smaller than the area of the tested wafer. In addition, the invention also discloses a method of testing a wafer by using the probe station. The method comprises the following steps that: (1), negative pressures are loaded on the upper surfaces of the supports; (2), a tested wafer is placed above the supports and is sucked by using the negative pressure; (3), the wafer moves with the supports, and when a tested chip is moved between a clamp late and a probe card, the chip is tested. According to the invention, the upper surface area of the clamp plate of the probe station is reduced and the wafer is fixedly supported by the multiple supports, so that the back of the thin wafer can be well contacted with the clamp plate of the probe station and thus the testing precision is improved.

Description

Technical field [0001] The invention relates to the field of large-scale integrated circuit testing, in particular to a novel probe station structure and a method for testing wafers by using the probe station. Background technique [0002] When testing existing large-scale integrated circuits, generally the wafer is directly placed on the chuck (chuck) of the probe station. During testing, a negative pressure is applied to the chuck to attract the wafer, and then the wafer Move along with the chuck for testing. [0003] In general, the size of the chuck of the probe station is the same as the size of the wafer. For thicker wafers, after the wafer and the chuck are aligned, they are placed flat on the surface of the chuck (the surface is solid), and they will be in good contact, such as figure 1 As shown, in this way, the wafer will move with the chuck during testing. [0004] For thin wafers, such as when the thickness is less than 140μm, the wafer itself will warp, such as figure...

Claims

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Application Information

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IPC IPC(8): G01R31/28
Inventor 辛吉升桑浚之
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP