Circuit board and surplus-glue processing method thereof

A processing method and circuit board technology, which are applied in the secondary processing of printed circuits, printed circuits, and printed circuit manufacturing, etc., can solve the problems of the appearance and reliability of the circuit board that cannot remove the excess glue by shoveling the brush plate, and achieve the removal of excess glue. Simple and fast effects

Active Publication Date: 2014-06-11
SHENNAN CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a method for treating residual glue of circuit boards, especially for local mixed-voltage circuit boards, ai

Method used

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  • Circuit board and surplus-glue processing method thereof
  • Circuit board and surplus-glue processing method thereof
  • Circuit board and surplus-glue processing method thereof

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] Please refer to figure 1 , the residual glue processing method of the circuit board provided by the embodiment of the present invention comprises the following steps:

[0023] Prepare the daughter board of the mixed voltage circuit board;

[0024] Prepare the motherboard of the mixed voltage circuit board;

[0025] Prepare the core board of the mixed voltage circuit board;

[0026] The outer layer treatment includes lamination process, single-sided micro-etching copper reduction process, leveling and brushing process, drilling process, electroplating process and outer layer graphics trans...

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Abstract

The invention provides a surplus-glue processing method of a circuit board, wherein the method is suitable for manufacturing a circuit board, and aims to solve the problems that by means of leveling and board brushing in the prior art, surplus glue cannot be removed, and the appearances of circuit boards cannot be guaranteed. The surplus-glue processing method of the circuit board comprises the following steps that a daughter board of a mixed-voltage circuit board is prepared; a mother board of the mixed-voltage circuit board is prepared; a core board of the mixed-voltage circuit board is prepared; as for outer processing, laminating technique processing, single-face microetching copper reduction technique processing, leveling and board brushing technique processing, drilling technique processing, electroplating technique processing and outer pattern transfer technique processing are conducted in sequence. The invention further provides the circuit board formed in the surplus-glue processing method of the circuit board. According to the method, the surplus glue is removed in batches by means of leveling and board brushing, so that it is guaranteed that the thickness of copper of the circuit board reaches a required value; besides, it is guaranteed that the appearance of the circuit board is undamaged, good reliability is obtained, the defects produced by manual glue removing can be overcome, and batch processing of glue removing can be achieved.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a circuit board and a method for treating residual glue of the circuit board. The circuit board is a local mixed-voltage circuit board. Background technique [0002] Partial mixed-voltage circuit boards have been widely used in the processing of various circuit boards. For example, high-frequency or high-speed materials are used locally to realize high-frequency signal functions and save material costs, and high-level sub-boards are partially embedded to save overall circuit boards. level. However, there is a problem in the processing technology of these circuit boards, that is, there is a certain amount of residual glue left between the sub-board and the mother board after lamination, which needs to be removed. Since there is usually a height difference between the sub-board and the motherboard, the excess glue tends to accumulate in relatively short places, an...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/22H05K1/02
Inventor 冷科王浩
Owner SHENNAN CIRCUITS
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