A regular octagonal three-ring magnetic field coil
A technology of regular octagon and magnetic field coil, applied in the field of regular octagon three-ring magnetic field coil, can solve the problems of low uniformity order, uneven force, change of coil constant, etc., and achieves good uniformity, improved uniformity, The effect of low non-uniformity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0020] Take three regular octagonal coils with equal side lengths and centroid distances as an example for illustration.
[0021] Such as figure 2 Shown is a schematic diagram of a regular octagonal coil, where the vertical distance from the center of the coil to each side is a (the center distance), and the side length of each side of the regular octagonal coil is b, which can be deduced from the geometric relationship b = ( 2 2 - 2 ) a .
[0022] According to the Biot-Safar law, the magnetic induction intensity generated by any side of the regular octagonal coil with current I at point P is as follows: image 3 As shown, are:
[0023] B 1 / = μI 2 ...
Embodiment 2
[0048] Take three regular octagonal coils with the same number of turns as an example for illustration.
[0049] The specific reasoning process is similar to Embodiment 1, and will not be repeated here. When the turns of the three regular octagonal coils are equal, the three regular octagonal coils are arranged at equal intervals, and the center between two adjacent coils Distance d / 2 and the centroid distance a of the coil at the middle position 1 The ratio of is 0.70409, and the apothem a of the regular octagonal coil in the middle position 1 The centroid distance a of the regular octagonal coil located on both sides 2 satisfy the relationship:
[0050] a 2 a 1 = 0.82447 .
[0051] The three regular octagonal coils in the present invention are respectively wound on the regular octagonal skeleton, the distance between the three regular octag...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 