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A manufacturing process of ultra-thin substrate

A manufacturing process and substrate technology, which is applied to the manufacturing process of ultra-thin substrates, can solve problems such as low product yield, and achieve the effects of improving strength, improving alignment accuracy, and reducing difficulty.

Active Publication Date: 2017-04-12
SHENZHEN SIPTORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Product yield is low

Method used

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  • A manufacturing process of ultra-thin substrate
  • A manufacturing process of ultra-thin substrate
  • A manufacturing process of ultra-thin substrate

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with specific examples.

[0033] A manufacturing process of an ultra-thin substrate comprises the following steps:

[0034] a. The first composite copper foil layer 1, the first adhesive layer 5, the second composite copper foil layer 2, the second adhesive layer 6, the support plate 9, the third adhesive layer 7, and the third composite The copper foil layer 3, the fourth adhesive layer 8 and the fourth composite copper foil layer 4 are sequentially bonded together; the first composite copper foil layer 1, the second composite copper foil layer 2, the third composite copper foil layer 3 and The fourth composite copper foil layer 4 is composed of a supporting base layer and a copper foil layer; the copper foil layers in the first composite copper foil layer 1 and the second composite copper foil layer 2 are arranged facing each other, and the third composite copper foil layer 3 The copper foil layer i...

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Abstract

The invention discloses a manufacturing technology of an ultra-thin substrate. The manufacturing technology includes the lamination step, the drilling step, the conduction and circuit manufacturing step, the multiple plate laminating step, the stripping step, the surface layer forming step and the separating step. According to the manufacturing technology of the ultra-thin substrate, a supporting board is used for enhancing the strength of the ultra-thin substrate. Due to the fact that the supporting board is used, buckling and deforming of the ultra-thin substrate are relieved, and the manufacturing technology of the ultra-thin substrate can be compatible with a conventional substrate technology. According to the manufacturing technology of the ultra-thin substrate, the supporting board is adopted, expansion and contraction of the substrate can be effectively controlled, alignment precision is improved, and difficulty is lowered for subsequent technologies.

Description

technical field [0001] The invention discloses a manufacturing process of an ultra-thin substrate, which belongs to the technical field of semiconductors. Background technique [0002] As the requirements for the size of the package become higher and higher, the requirement for the thickness of the substrate, which is an important part of the package, is also higher and higher. Ultra-thin substrates are one way to reduce the thickness of substrates. The ultra-thin substrate uses a very thin (less than 100um, usually 20~40um) core layer to prepare the substrate. One of the main problems is that the very thin core layer is inconvenient to process, it is very easy to damage and deform, and it is incompatible with the conventional substrate processing technology in many aspects, for example: in horizontal line processing and electroplating copper, such a thin core layer is very easy to damage, Seriously affect product quality and yield. [0003] At present, the most important...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/14
Inventor 刘文龙
Owner SHENZHEN SIPTORY TECH CO LTD