Package structure and manufacturing method thereof

Abstract

Disclosed is a manufacturing method of a package structure. The method includes the following steps: providing a first copper foil which includes at least one surface-mount area and fixing at least one element on a surface-mount area through a non-conductive electric-glue layer; providing an inner-layer core plate which is provided with at least one second through hole; and providing a first adhesive sheet, a second adhesive sheet and a second copper foil, wherein at least one forth through hole is formed in the first adhesive sheet and each forth through hole is corresponding to a second through hole; sequentially laminating and thermopressing a bearing plate, the first copper foil, the first adhesive sheet, the inner-layer core plate, the second adhesive sheet and the second copper foil so as to make the elements pass through the forth through holes and accommodated in the second through holes; and then manufacturing the first copper foil and the second copper foil so as to form a first external-layer conductive circuit layer and a second external-layer conductive circuit layer so that a package structure is formed. The invention also provides the package structure manufactured through the above-mentioned manufacturing method.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a packaging structure and a manufacturing method thereof. Background technique [0002] One of the manufacturing methods of the packaging structure commonly used in the industry is: providing a copper-clad core board, the copper-clad core board includes a first conductive circuit layer, a first insulating layer and a second conductive circuit layer; Form a through hole through the copper clad core board; provide an electronic component, a first outer conductive layer, a second insulating layer, a third insulating layer and a second outer conductive layer, wherein the electronic component The height of the device is equivalent to the thickness of the first insulating layer of the copper clad core board, the size of the electronic component is smaller than the size of the through hole, and the second insulating layer and the third insulating layer have semi-cured properties...

AI Technical Summary

Problems solved by technology

However, in the packaging structure made by the above method, in order to accommodate the electronic components in the through holes of the first insulating layer, the thickness of the first insulating layer must be set to be equivalent to the thickness of the electronic components, thus limiting The thickness of the first insulating layer prevents the thinning of the first insulating layer, thereby limiting the thinning of the overall thickness of the package structure

Images