LED modules powered by multiple welding legs

A technology of LED modules and soldering pins, which is applied in the field of semiconductor lighting, can solve the problems that ordinary power supplies cannot fully utilize the performance advantages of high-power LEDs and high costs

Inactive Publication Date: 2014-06-25
苏州科医世凯半导体技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, high-power LED light sources are generally required to work at high current density, so there are strict requirements for high-performance power supplies. Ordinary power supplies cannot fully utilize the performance advantages of high-power LEDs, and the existing general-purpose power supplies are completely replaced with high-power ones. performance power supply, the cost is too high, and there is an urgent need for a light source module that can realize low-current power supply

Method used

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  • LED modules powered by multiple welding legs
  • LED modules powered by multiple welding legs
  • LED modules powered by multiple welding legs

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, it is a schematic diagram of the structure of a traditional LED module with a single solder pin, which consists of solder pins (1), positioning holes (2), high thermal conductivity substrate (3), LED chips (4), thermistors (5), etc. composition. The solder pin (1) is packaged on the high thermal conductivity substrate (3) to realize the power supply to the module; the LED chip (4) is packaged on the high thermal conductivity substrate (3) to form a common anode structure, and the positioning hole (2) realizes the power supply of the LED chip (3) Accurate positioning. When the LED module shown in this diagram works under high power, the power supply needs to provide a high current to the module through the solder pins, so the requirements for the power supply are very strict.

Embodiment 2

[0026] Such as figure 2 As shown, two solder pins (1) are packaged on the high thermal conductivity substrate (3). The two soldering legs are respectively connected to the power supply, which can supply power to the module at the same time. Therefore, a small current can be applied to the two soldering legs at the same time, and a large current can be obtained by accumulating, so that the high-power LED module can operate at a high current. The working requirements under high density greatly reduce the system's requirements for high-performance power supplies. The module in Embodiment 2 has the same working principle as the module shown in Embodiment 1 except that the power supply mode is different.

Embodiment 3

[0028] Such as image 3 As shown, four solder pins (1) are packaged on the high thermal conductivity substrate (3). The four soldering legs are respectively connected to the power supply, which can supply power to the module at the same time. The working principle of embodiment 2 is similar to that of embodiment 2, but it can realize power supply with smaller current, which further reduces the requirement of the system on the power supply.

[0029]

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Abstract

The invention discloses LED modules powered by multiple welding legs. Two, three, four, or more welding legs are combined to supply power for the LED modules, wherein each LED module comprises a highly thermal conductive substrate, an LED chip and welding legs; the highly thermal conductive substrate is a metal substrate or a ceramic substrate; the welding legs are directly welded on the highly thermal conductive substrate; the LED chip is a common-anode structure that is directly and fixedly connected to the highly thermal conductive substrate. According to the LED modules powered by multiple welding legs disclosed by the invention, multiple welding legs are used to supply power for the chips of the LED modules independently, so that the chips are currently driven by multiple low currents through the multiple welding legs while high light efficiency of the common-anode structures of the chips is kept, as a result, a light emission effect the same as that provided by a single high current is acquired by accumulation of multiple low currents, the requirement of a system on a high-performance power supply is greatly reduced, ultrahigh-power LED modules can be driven to work normally by using the currently widely used common power supply, and system cost is greatly reduced; the LED modules powered by multiple welding legs have a wide application prospect in fields like stage lighting, long-distance projection and special lighting which need high luminance requirements.

Description

technical field [0001] The invention relates to the technical field of semiconductor light emitting. [0002] Background technique [0003] Semiconductor light sources, such as light-emitting diodes and LED light sources, have the advantages of short start-up time, high brightness, low energy consumption, small size, long life, and high safety, and are gradually replacing traditional halogen lamps, xenon lamps and other high-energy, short-life light sources , has been widely used. [0004] At present, high-power LED light sources are generally required to work at high current density, so there are strict requirements for high-performance power supplies. Ordinary power supplies cannot fully utilize the performance advantages of high-power LEDs, and the existing general-purpose power supplies are completely replaced with high-power ones. Performance power supply, the cost is too high, and there is an urgent need for light source modules that can realize low-current power sup...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V23/06F21Y101/02
Inventor 熊大曦杨西斌
Owner 苏州科医世凯半导体技术有限责任公司
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