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Lead frame processing method

A processing method and lead frame technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of limited manufacturing accuracy and difficulty in meeting needs, and achieve the effect of controlling processing accuracy

Active Publication Date: 2016-09-28
SKY CHIP INTERCONNECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of production and practice, the inventors found that the use of traditional stamping and etching processes to produce lead frames is limited in terms of production accuracy, and it is difficult to meet the needs in some scenarios with higher requirements.

Method used

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Embodiment Construction

[0031] An embodiment of the present invention provides a lead frame processing method in order to further improve the manufacturing accuracy of the lead frame.

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchange...

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Abstract

The invention discloses a leading wire framework processing method. The leading wire framework processing method comprises steps that: a first face of a carrier material is processed to form a first conductive layer; the first conductive layer is provided with a medium layer; the medium layer is provided with a second conductive layer; multiple holes are formed on the second conductive layer through drilling and penetrate through the first conductive layer; a film is pasted on the second conductive layer on which the multiple holes are formed through drilling; exposure development processing on the film is carried out to expose a line graph area and the holes, and the residual film after exposure development processing covers a non-line graph area of the second conductive layer; a conductive substance is filled in the holes, and the conductive substance in the line graph area is thickened; the residual film on the second conductive layer is removed; the conductive substance in the non-line graph area of the second conductive layer is removed.

Description

technical field [0001] The invention relates to the technical field of circuit board processing and manufacturing, in particular to a method for processing a lead frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the internal circuit of the chip and the external lead by means of a bonding material (gold wire, aluminum wire or copper wire) to form an electrical circuit. Among them, the lead frame plays the role of a bridge connecting with the external wires. At present, most of the semiconductor integrated chips need to use the lead frame. The lead frame is an important basic device in the electronic information industry. [0003] At present, the traditional lead frame production process is divided into two categories: punching type and etching type, and punching type production is currently the mainstream. For example, there are hundr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCH01L21/4821
Inventor 陈冲刘德波孔令文彭勤卫杨志刚
Owner SKY CHIP INTERCONNECTION TECH CO LTD