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Image sensor packaging structure and packaging method thereof

A technology of image sensor and packaging method, which is applied in the direction of radiation control devices, etc., to achieve the effects of preventing pollution or damage, improving integration, and facilitating identification

Active Publication Date: 2014-07-02
CHINA WAFER LEVEL CSP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The problem solved by the present invention is how to prevent chip contamination or damage during the packaging process of image sensor chips, and improve the production efficiency of packaging

Method used

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  • Image sensor packaging structure and packaging method thereof
  • Image sensor packaging structure and packaging method thereof

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Embodiment Construction

[0060] As mentioned in the background art, when the image sensor chip is packaged in the prior art, since the image sensing area of ​​the image sensor is completely exposed, it is very easy to cause pollution or damage, which affects the reliability and stability of the formed image sensor package structure. sex. Moreover, the connection between the pads on the image sensor chip and the PCB through metal wires makes the device size unable to meet the ideal requirements, which is not conducive to the improvement of device integration.

[0061] For this reason, the present invention provides a kind of packaging structure of image sensor and packaging method thereof, wherein in the packaging method of image sensor, the formed cavity wall and adhesive tape layer seal the image sensing area, prevent the image sensing area from being exposed, and cut the second During the process of removing the substrate material and the remaining second substrate material on the welding pad, formi...

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Abstract

The invention provides an image sensor packaging structure and a packaging method thereof. The image sensor packaging structure comprises an image sensor chip, a cavity wall, metal protrusions and a PCB substrate. An image induction area and a first welding disc surrounding the image induction area are arranged on the upper surface of the image sensor chip, the cavity wall is arranged on the upper surface of the image sensor chip between the image induction area and the first welding disc and surrounds the image induction area, and a cavity is formed in the image induction area; the metal protrusions are arranged on the first welding disc, the PCB substrate is arranged on the image sensor chip,, a first opening which penetrates through the PCB substrate is formed in the PCB substrate, a second welding disc is arranged on the PCB substrate located on the periphery of the first opening, a lens module is arranged on the surface, away from the second welding disc, of the PCB substrate, and the second welding disc of the PCB substrate is bonded with the first welding disc on the image sensor chip through the metal protrusions. Damage or pollution of the image induction area of the packaging structure is little, and stability and reliability of a packaging device are improved.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an image sensor packaging structure and a packaging method thereof. Background technique [0002] Image sensors receive light signals from objects and convert them into electrical signals that can be transmitted for further processing, such as digitization, and then stored in a storage device such as memory, optical or magnetic disks, or for display on a display display etc. Image sensors are commonly used in devices such as digital still cameras, video cameras, scanners, facsimile machines, and the like. Image sensors generally include charge-coupled device (CCD) image sensors and CMOS image sensors (CIS, CMOS Image Sensor). Compared with CCD image sensors, CMOS image sensors have the advantages of high integration, low power consumption, and low production cost. [0003] As the size of the image sensor becomes smaller and smaller, the number of pads increases and the spa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
Inventor 王之奇喻琼杨莹王蔚
Owner CHINA WAFER LEVEL CSP
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