Anisotropy film heat conductivity testing method and device based on heat flux sensors

Abstract

The invention discloses an anisotropy film heat conductivity testing method and device based on heat flux sensors. A plurality of heat flux sensors are embedded into a testing platform; a substrate of a sample to be tested is arranged on the upper surface of the testing platform; a film sample to be tested is arranged on the upper surface of the sample substrate; a heating end is positioned on the surface of the film to be tested; the plurality of the heat flux sensors are embedded in a straight line shape in equal distance in the horizontal direction of the testing platform; the upper surface of each heat flux sensor is leveled with the upper surface of the testing platform; a computer is adopted to record heat flux testing values of the plurality of heat flux sensors respectively at the same moment, and calculate the average heat conductivity of the film to be tested in the horizontal direction according to Fourier formulae; the substrate of the sample to be tested and the film to be tested are turned over as a whole, the heat flux value of one of the heat flux sensors is recorded, and the heat conductivity of the film to be tested in the vertical direction is calculated according to formulae. The heat conductivity of the film in the horizontal and vertical directions can be effectively and fast measured for one time.

Description

technical field [0001] The invention relates to a heat flux sensor (Heat Flux Sensor, HFS)-based thin film thermal conductivity testing device and method for testing the thermal conductivity of current thin film materials and structures. Background technique [0002] With the development of micro / nano electronic technology, thin film materials and structures have been widely used in electronic components, solar cells, detectors, sensors and other fields. Thermal conductivity is one of the main parameters of material characteristics, and its level determines It affects the quality of the heat dissipation characteristics of the whole device. At present, there are many methods for testing the thermal conductivity of bulk materials, but due to the influence of the structural size (thickness) of the film, the conventional measurement device can no longer meet the requirements of the thermal conductivity test of the film, and the thermal conductivity of the film cannot be obtained...

AI Technical Summary

Problems solved by technology

At present, there are many methods for testing the thermal conductivity of bulk materials, but due to the influence of the structural size (thickness) of the film, the conventional measurement device can no longer meet the requirements of the thermal conductivity test of the film, and the thermal conductivity of the film cannot be obtained. Fast, Accurate Measurements

At the same time, the existing methods and devices for measuring the thermal conductivity of thin films are very complicated. Taking the 3ω method as an example, the system must use complex equipment such as lasers, amplifiers, and sophisticated optical systems to form a testing system; otherwise, it is impossible to complete the measurement of the thermal conductivity of thin films. Measurement

Chinese patent application number 2010101334868 provides a method and device for testing the thermal conductivity of thin films, but the premise of using the device and method is to ensure that the thermal conductivity of the substrate is much greater than the thermal conductivity of the thin film material, but It cannot adapt to the case where the thermal conductivity of the substrate is lower than that of the thin film material. When the thermal conductivity of the thin film material (such as graphene) is much higher than that of the substrate material, the device cannot be tested

Therefore, the existing thin film thermal conductivity test methods and devices have problems such as high cost, complex system, complicated operation, and limited testing.

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