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Stacked light emitting diode array structure

A technology of light-emitting diodes and array structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of increasing cost and setting volume

Inactive Publication Date: 2014-07-30
MEILU SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light-emitting diode array 200 must use each packaged light-emitting diode element 23 as a basic component, which will relatively increase the cost of the package and the overall installation volume.

Method used

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  • Stacked light emitting diode array structure
  • Stacked light emitting diode array structure
  • Stacked light emitting diode array structure

Examples

Experimental program
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Effect test

Embodiment Construction

[0040] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0041] see image 3 , is a structural schematic view of a preferred embodiment of the stacked LED array structure of the present invention. As shown in the figure, the LED array 300 includes a substrate 31 and a plurality of LED dies 33 .

[0042] Each LED die 33 is sequentially stacked on the substrate 31 , and each includes a first semiconductor layer 331 and a second semiconductor layer 333 . The first semiconductor layer 331 is an N-type semiconductor layer, and the second semiconductor layer 333 is a P-type semiconductor layer.

[0043]The deposition process is used to deposit the second semiconductor layer 333 of each light emitting diode die 33 on a part of the surface of the first semiconductor layer 331, and to deposit the first semiconductor layer 331 of each light emitting diode die 33 on top of each other. It is...

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PUM

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Abstract

The invention provides a stacked light emitting diode array structure. The structure comprises a substrate and multiple light emitting diode dies which are sequentially stacked on the substrate. Each of the light emitting diode dies comprises a first semiconductor layer and a second semiconductor layer, wherein a first electrode is arranged on the first semiconductor layer, and the second semiconductor layer is stacked on the first semiconductor layer; and a second electrode is arranged on the second semiconductor layer, and the first semiconductor layer of another light emitting diode die is stacked on the second semiconductor layer. The second electrode of each light emitting diode die is connected with the first electrode of another light emitting diode die through a metal layer, thereby forming a light emitting diode array in a series connection manner. In other words, the multiple light emitting diode dies are stacked to form the light emitting diode array through a stacking mode. Not only is the manufacture easy, but also the arrangement size of the overall light emitting diode array can be reduced effectively.

Description

technical field [0001] The invention relates to a light emitting diode array structure, in particular to a stacked light emitting diode array structure. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a semiconductor light emitting element, which will emit light when it is applied with a forward bias voltage. At present, light-emitting diodes have been developed to operate on high-voltage AC power sources (such as AC110V / 220V). Furthermore, because light-emitting diodes have the advantages of low power consumption and long service life compared with light bulbs (such as incandescent bulbs) or fluorescent tubes (such as fluorescent tubes), light-emitting diodes gradually replace light bulbs or fluorescent tubes as lighting. use. [0003] When LEDs are used for lighting purposes, generally a plurality of LEDs are connected in series to form an array, so as to obtain a wide light-emitting area by utilizing the plurality of LEDs to emit ligh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15
CPCH01L25/0753H01L27/153H01L33/62H01L2224/48091H01L2224/48137H01L2224/45144H01L2924/00014H01L2924/00H01L25/0756
Inventor 蔡文钦赖力弘
Owner MEILU SCI & TECH
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