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staged full etch process

A staged, etching technology, applied in the field of etching technology, can solve the problems of affecting the appearance of the product, poor product function, product damage, etc., to achieve the effect of convenient processing or use, reasonable design of process steps, and simple process

Active Publication Date: 2016-06-15
苏州市吴中区伟良电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existence of this connection point not only affects the appearance of the product, but also causes damage to the product in contact with it, and eventually causes the product to function poorly. Therefore, in order to ensure the appearance of the product and its good function, it is necessary to use additional processes to remove it. connection points on the product, which increases the cost of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The staged full etching process of the present invention will be described in detail below.

[0024] The staged full etching process of the present invention mainly includes three major stages, namely: substrate ink and exposure stage, first etching stage on one side of the substrate, and secondary etching stage on the other side of the substrate. The operation steps of each stage are described in detail below:

[0025] (1), substrate ink and exposure stage

[0026] First of all, after the substrate is cleaned, the two sides are recorded as A side and B side respectively, and then use 85-95 mesh screen plate to evenly print solder resist ink on the A side and B side of the substrate. Screen printing can effectively control the thickness of the coating film to prevent the coating film from being too thick or too thin. If the coating film is too thick, it will easily cause residual film or insufficient drying. If the coating film is too thin, it will easily cause poor res...

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PUM

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Abstract

The invention discloses a staged total etching technology. The technology is characterized in that the technology comprises an ink coating and exposing stage of double surfaces of a substrate, a primary etching stage of one surface of the substrate, and a secondary etching stage of the other surface of the substrate. The technology has the advantages of reasonable process step design, simple preparation process, easy operation, low center of gravity, stable operation and unlikely product damage; etched products produced by adopting the technology have no connection points, are beautiful and have good use functions; and a sticky membrane is used as a carrier, so products are not scattered after the total etching is completed, and are still tidily arranged on the sticky membrane, and subsequent product processing or use is convenient.

Description

technical field [0001] The invention relates to an etching process, in particular to a staged full etching process. Background technique [0002] Using the existing etching process to produce etched products, in order to prevent the product from falling off during the turnover process, or to facilitate the subsequent product surface processing, connection points are usually designed on the edge of the product shape. However, the existence of this connection point not only affects the appearance of the product, but also causes damage to the product in contact with it, and eventually causes the product to function poorly. Therefore, in order to ensure the appearance of the product and its good function, it is necessary to use additional processes to remove it. connection points on the product, which increases the cost of the product. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the purpose of the present invention is to provide a s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/02
Inventor 周雪良
Owner 苏州市吴中区伟良电子有限公司