Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer probe method and device

A technology of needle measurement and wafer, which is applied in the field of wafer needle measurement methods and devices, can solve the problems of grain surface damage, decrease of yield rate, and decrease of product circulation speed, and achieve the effect of avoiding secondary testing and improving yield rate

Active Publication Date: 2016-09-21
FOUNDER MICROELECTRONICS INT
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, re-testing will not only cause damage to the surface of the die due to repeated needle sticking, but also increase due to improper operation of personnel during the test, changes in the external environment, poor state of the probe card, or hardware and hardware between needle testers. Improper setting of operating parameters will cause abnormal situations such as needle mark deviation or copper exposure during wafer needle testing, resulting in the probability of false killing during testing, which will also cause a decline in yield and product failure. Reduced throughput and high testing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer probe method and device
  • Wafer probe method and device
  • Wafer probe method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] According to the automatic comparison result of the second parameter specification and the first test result, the second dotted information is automatically formed, specifically including:

[0027] Each parameter requirement in the second parameter specification is automatically compared with the parameter result of each grain corresponding item in the first test result;

[0028] Mark the position information of the grains that do not meet the requirements of any parameter;

[0029] All marked position information is counted to form the second dotted information.

[0030] In this embodiment, an alternative method is adopted. The second parameter specification is compared with each corresponding item in the first test result one by one. If it meets the requirements of the parameter specification, the position information of the grain is marked, and after the comparison is completed, all the marked position information is counted to form the second dot information, and t...

Embodiment 2

[0033] According to the automatic comparison result of the second parameter specification and the first test result, the second RBI information is automatically formed, specifically including:

[0034] replacing each parameter requirement in the second parameter specification with each corresponding original parameter requirement in the first parameter specification in the first test result;

[0035] Each parameter requirement in the second parameter specification is automatically compared with the parameter result of each grain corresponding item in the first test result;

[0036] According to the comparison result, the first dotted information is automatically modified to form the second dotted information.

[0037] In Embodiment 2 of the present invention, the method of modification is adopted, based on the first test result, the first parameter specification is modified to the second parameter specification, and then automatic comparison is performed according to the speci...

Embodiment approach

[0046] It can be understood that the specific process of automatic comparison by the comparison module can be divided into various implementation methods based on the above principles, for example:

[0047] Embodiment one

[0048] The comparison module can be specifically used for:

[0049] Each parameter requirement in the second parameter specification is automatically compared with the parameter result of each grain corresponding item in the first test result;

[0050] Mark the position information of the grains that do not meet the requirements of any parameter;

[0051] All marked position information is counted to form the second dotted information.

[0052] In this embodiment, an alternative method is adopted. The second parameter specification is compared with each corresponding item in the first test result one by one. If it meets the requirements of the parameter specification, the position information of the grain is marked, and after the comparison is completed,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wafer probing method and a wafer probing device and relates to the technical field of semiconductor chip manufacturing processes. By the wafer probing method and the wafer probing device, in the wafer probing process, retesting of crystal grains which are tested already is not needed. The wafer probing method includes acquiring a first testing result according to first parameter standards and testing conditions, wherein the first testing result includes first dotting information used for indicating crystal grain position not meeting the first parameter standards; when the first parameter standards are changed into second parameter standards, automatically generating second dotting information not meeting the second parameter standards according to an automatic comparison result of the second parameter standards and the first testing result; utilizing the second dotting information to replace the first dotting information to form a second testing result.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing technology, and in particular to a wafer needle measurement method and device. Background technique [0002] Before the chip is assembled, it needs to carry out chip probing (Chip Probing, CP). Wafer probing is to use the tester (Tester), the collocation between the prober (Prober) and the probe card (Probe Card) Combined to test each die on the chip (Wafer), the purpose is to judge whether the product function of the die meets the requirements through electrical testing, whether the relevant electrical parameters are within the specification, and the die that does not meet the specification will be removed as soon as possible Screened out, dotted through the dotting process, so as to avoid packaging the failed grains when the chip is packaged, and avoiding the increase in the manufacturing cost caused by the subsequent process due to the high defect rate. [0003] When p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/20
Inventor 邱海亮蔡新春
Owner FOUNDER MICROELECTRONICS INT