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Die polishing process

A mold and process technology, applied in the field of mold grinding technology, can solve problems such as difficult to eliminate, easy to reflect, and hidden safety hazards, and achieve the effect of reducing the ability to reflect light, simple processing technology, and eliminating hidden safety hazards.

Inactive Publication Date: 2014-08-13
戴素琳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The surface of each part in the mold on the market is basically smooth, the surface is very smooth, easy to reflect light, there are two disadvantages: 1, the friction is not enough, it is easy to slide during the handling process; 2, the surface is reflective, easy to produce light Reflection, there is a stabbing of the operator in the production workshop, which poses a safety hazard
In view of the above two shortcomings, there has not been a process for grinding the surface of each part of the mold in the market, and it is difficult to eliminate the above two shortcomings

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A kind of mold embossing process is characterized in that: comprises the following steps:

[0018] The first step is to level the surface of the mold, and the leveling treatment includes rough grinding the surface of the mold, and then finely grinding the surface of the mold after rough grinding until it is flat, wherein, using sandpaper or a flap wheel to drive through the second driving source, The second driving source can be a mechanism such as a grinder or a milling machine, which finely grinds the rough-ground mold surface, and the sandpaper or the impeller moves concentrically along the polished surface of the mold.

[0019] The second step is to grind the surface of the mold after the flattening treatment, wherein the sandpaper is used to drive through the first driving source, and the first driving source can be a grinder, a milling machine and other mechanisms to grind the surface of the mold after the leveling treatment treatment, and the sandpaper moves ecce...

Embodiment 2

[0021] A mold embossing process, comprising the following steps:

[0022] The first step is to level the surface of the mold. The leveling treatment is to directly grind the surface of the mold until it is flat. Sandpaper or impellers are used to drive through the second driving source. The second driving source can be a grinding machine, a milling machine, etc. , finely grind the surface of the mold after rough grinding, and the sandpaper or the impeller moves concentrically along the polished surface of the mold.

[0023] The second step is to grind the surface of the mold after the flattening treatment, wherein the sandpaper is used to drive through the first driving source, and the first driving source can be a grinder, a milling machine and other mechanisms to grind the surface of the mold after the leveling treatment treatment, and the sandpaper moves eccentrically along the polished surface of the mold until the reflective ability of the mold surface is worn to a weaker...

Embodiment 3

[0025] A kind of mold embossing process is characterized in that: comprises the following steps:

[0026] The first step is to smooth the surface of the mold, and directly grind the surface of the mold until it is smooth. Among them, sandpaper or a flap wheel is used to drive through the second driving source. The second driving source can be a grinding machine, a milling machine and other mechanisms. The surface of the final mold is finely ground, and the sandpaper or the impeller moves concentrically along the polished surface of the mold.

[0027] The second step is to grind the surface of the flattened mold, wherein sandpaper is used to drive through the first driving source, and the first driving source can be a grinding machine, a milling machine and other mechanisms to grind the flattened mold surface treatment, and the sandpaper moves eccentrically along the polished surface of the mold until the reflective ability of the mold surface is worn to a weaker effect, preven...

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PUM

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Abstract

The invention relates to the field of dies, in particular to a die polishing process. The invention adopts the following technical scheme: the die polishing process is characterized by comprising the following steps of firstly, flattening the surface of the die; secondly, polishing the die surface subjected to the flattening. The die polishing process has the advantages that the surface of each part of the die is subjected to the polishing treatment by the specific polishing process, so the friction of the die surface is improved, the smoothness of the die surface is lower, the light reflecting capacity of the die surface is effectively reduced, an operator is prevented from being glared by reflecting light rays of the die surface, the safety loopholes are eliminated, the attraction degree of the die surface is greatly improved, the machining process is simple and the cost is lower.

Description

technical field [0001] The invention relates to the field of moulds, in particular to a mould-grinding process. Background technique [0002] Molds are various molds and tools used in industrial production for injection molding, blow molding, extrusion, die-casting or forging forming, smelting, stamping, stretching and other methods to obtain the required products. In short, a mold is a tool used to shape an object. This tool is composed of various parts, and different molds are composed of different parts. It mainly realizes the processing of the shape of the article through the change of the physical state of the formed material. [0003] The surface of each part in the mold on the market is basically smooth, the surface is very smooth, easy to reflect light, there are two disadvantages: 1, the friction is not enough, it is easy to slide during the handling process; 2, the surface is reflective, easy to produce light Reflection, there is a situation where the operator is...

Claims

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Application Information

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IPC IPC(8): B23P15/24B24B1/00B24B19/20
CPCB24B1/00B24B19/20
Inventor 戴素琳
Owner 戴素琳
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