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Aluminum-silicon/aluminum-silicon carbide composite material, preparation method thereof, and electronic packaging device

A composite material, aluminum silicon carbide technology, applied in the field of electronic packaging, can solve problems such as weld instability and achieve the effect of improving stability

Inactive Publication Date: 2015-10-28
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide an aluminum-silicon / aluminum-silicon carbide composite material and its preparation method, and an electronic packaging device, so as to solve the technical problem of unstable welding seam when the electronic packaging shell and the cover plate are welded by laser in the prior art

Method used

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  • Aluminum-silicon/aluminum-silicon carbide composite material, preparation method thereof, and electronic packaging device
  • Aluminum-silicon/aluminum-silicon carbide composite material, preparation method thereof, and electronic packaging device
  • Aluminum-silicon/aluminum-silicon carbide composite material, preparation method thereof, and electronic packaging device

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preparation example Construction

[0040] Another invention of the present invention also provides the preparation method of composite material, comprises the following steps:

[0041] 1) Put the aluminum-silicon material layer prepared by spray deposition on the top surface of the silicon carbide preform to obtain the composite preform 731, put the composite preform into a mold and preheat at a constant temperature of 550°C to 650°C for 2 hours to 3 hours Hour;

[0042] 2) melting the aluminum alloy to obtain liquid aluminum 742;

[0043] 3) After evacuating, fill with inert gas to a constant temperature and pressure of 1.5MPa-2.0MPa for 5 minutes to 15 minutes, then lower the temperature and pressurize to 8MPa-12MPa to obtain an aluminum-silicon / aluminum-silicon carbide composite material.

[0044] The method is carried out by means of a vacuum pressure infiltration furnace. Vacuum pressure infiltration furnace structure see Figure 5 , The vacuum pressure infiltration furnace includes a furnace body 70 an...

Embodiment 1

[0069] 1) Preparation of silicon carbide preforms

[0070] Weigh 100g of silicon carbide particles (average particle size: 63μm), 20g of polyvinyl alcohol solution, and 4.5g of aluminum dihydrogen phosphate, mix with a stirring kneader for 1 hour, then granulate, and pressurize at a pressure of 100MPa to make a 70mm× A flat silicon carbide blank with a size of 40mm×10mm was sintered at a constant temperature of 800°C at a rate of 3°C / min for 1.5 hours to obtain a silicon carbide preform blank with a density of 1.75g / cm3. A 61mm×40mm×1.5mm groove is milled on a 70mm×40mm plane by CNC milling.

[0071] 2) Preparation of laser welding layer

[0072] Spray-deposited aluminum-silicon material (the mass percentage of silicon is 55%, the average particle size of silicon particles is about 90 μm, and the oxygen content is 900×10 -6 ) processing length 60.4mm × width 39.6mm × thickness 1.45mm sheet.

[0073] 3) Preparation of composite materials

[0074] A laser welded layer was pl...

Embodiment 2

[0081] 1) Preparation of silicon carbide preforms

[0082] Weigh 70g of silicon carbide particles A (average particle size: 80μm), 21g of silicon carbide particles B (average particle size: 20μm) and 9g of silicon carbide particles C (average particle size: 7μm), 20g of polyvinyl alcohol solution and dihydrogen phosphate Aluminum 4.5g, mixed with a stirring kneader for 1 hour and then granulated, pressurized at a pressure of 100MPa to form a flat silicon carbide green body with a size of 70mm×40mm×10mm, and raised to 800℃ at a rate of 3℃ / min. After one hour sintering, a silicon carbide preform blank was obtained with a density of 2.07 g / cm3. processed by CNC milling Figure 4 SiC preform shown.

[0083] 2) Preparation of laser welding layer

[0084] The laser welding layer is made of aluminum-silicon material obtained by spray deposition as a raw material to form a laser welding layer with an outer ring size of 63.50mm×39.6mm, an inner ring size of 61.2mm×36.2mm, and a thic...

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Abstract

The invention provides an aluminium-silicon / aluminium-silicon carbide composite material, a preparation method thereof and an electronic packaging apparatus. The composite material comprises a laser welding layer and an aluminium-silicon carbide layer. The laser welding layer is disposed on the upper surface layer of the aluminium-silicon carbide layer. The laser welding layer is an aluminium-silicon material formed by spray deposition. According to the composite material, the upper surface layer of the aluminium-silicon carbide layer is synchronously integrated with the spray deposition aluminum-silicon layer with good laser welding properties. The oxygen content of the aluminum-silicon material layer obtained by spray deposition is not more than 1000*10<-6> and particles in the silicon phase are small in size and deeply connected with each other to form a net, and therefore the stability of laser welding seams of the composite material is enhanced and the composite material satisfies the requirements of micro-circuit module shell materials.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to an aluminum-silicon / aluminum-silicon carbide composite material, a preparation method thereof, and an electronic packaging device. Background technique [0002] The materials used in the packaging of the microcircuit assembly shell must meet the requirements of high thermal conductivity, low density, expansion coefficient and low-temperature co-fired ceramics, good mechanical properties and processing characteristics, and good laser welding characteristics. Body reliability is guaranteed. At the same time, the deformation of the shell bottom plate of the microcircuit assembly shell during the production process shall not be greater than 0.10mm. At present, the casing packaging material mainly adopts aluminum alloy, copper alloy, Kovar alloy, W / Cu alloy and other materials. However, the expansion coefficient of aluminum alloy and copper alloy is too high, the density of Kovar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/02
Inventor 白书欣熊德赣李顺赵恂张虹万红
Owner NAT UNIV OF DEFENSE TECH