Electronic component connection structure and connecting method

A technology of electronic components and connection structure, which is applied in the field of connection structure and connection of electronic components, can solve the problems of connection reliability reduction and achieve the effect of improving connection reliability

Inactive Publication Date: 2014-08-27
KK TOKAI RIKA DENKI SEISAKUSHO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case where the thickness of the conductive joining member is relatively thin, even if a thin-walled stress relieving part is used, the connection reliability will decrease.

Method used

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  • Electronic component connection structure and connecting method
  • Electronic component connection structure and connecting method
  • Electronic component connection structure and connecting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Hereinafter, one Embodiment of the connection structure of an electronic component is demonstrated.

[0022] Such as figure 1 As shown, two plate-shaped lead frames 2 and 3 are arranged apart from each other on the upper surface of the substrate 1 . The respective lead frames 2, 3 are integrated to the substrate 1 by insert forming, for example. A chip capacitor 4 , which is an example of an electronic component, is bridged between the two lead frames 2 and 3 . The chip capacitor 4 is connected to the two lead frames 2 and 3 by solder 5 which is a conductive bonding member.

[0023] Such as figure 2 As shown, two electrodes 41 (only the electrode 41 on the right side is shown) are respectively provided on the surfaces of both ends of the chip capacitor 4 , and the two electrodes 41 are continuous from the upper surface to the lower surface via the side surfaces. Each electrode 41 includes: an electrode 41 a formed by folding the first end of the electrode 41 inward...

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PUM

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Abstract

A connection structure for an electronic component, which is set on two lead frames (2, 3) spaced apart from each other. The electronic component (4) is connected to the two lead frames (2, 3) by a conductive joining member (5). The connection structure includes two electrodes (41 b) arranged on at least portions of a lower surface of the electronic component (4). The two electrodes (41 b) respectively face the two lead frames (2, 3). A receiving surface (21) is included in each of the two lead frames (2, 3) immediately below the corresponding electrode (41 b). The receiving surface (21) extends from a supporting portion supporting the electronic component (4) toward the other one of the lead frames (2, 3) and away from the electronic component. The conductive joining member (5) is located between the receiving surface (21) of each of the two lead frames (2, 3) and the corresponding one of the electrodes (41 b).

Description

technical field [0001] The present invention relates to an electronic component connection structure and a connection method, wherein the electronic component is bridged on two lead frames arranged apart from each other, and the electronic component is connected to the two lead frames through a conductive bonding member. Background technique [0002] Japanese Patent Application Laid-Open No. 2007-234737 discloses a technique in which a thin-walled stress relieving portion is provided in each lead frame in a connection structure of a chip capacitor. According to this technique, the stress generated in the conductive bonding member is relieved by the thin-walled stress relief portion. [0003] Stress occurring on the conductive bonding member concentrates between the chip capacitor and the lead frame. Connection reliability is largely affected by the thickness of the conductive joining members that stay therebetween. In the case where the thickness of the conductive joining ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K1/18
CPCH05K1/145H01L23/495H05K3/36H01L2924/0002H01L23/49548H01L23/49589H05K3/3442H05K2201/0382H05K2201/09745H05K2201/10636H01G2/065Y10T29/49126Y02P70/50H01L2924/00
Inventor伊藤肇
OwnerKK TOKAI RIKA DENKI SEISAKUSHO